一种外壳的锗窗口密封工艺研究  

Research on a Germanium Window Sealing Process for a Shell

作　　者：程书博[1] 张恒 刘旭 刘林杰[1] 谷丽 许保珍 CHENG Shu-bo;ZHANG Heng;LIU Xu;LIU Lin-jie;GU Li;XU Bao-zhen(The 13th Research Institute of China Electronics Technology Group Corporation,Shijiazhuang 050000,China)

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050000

出　　处：《价值工程》2024年第16期56-59,共4页Value Engineering

摘　　要：红外传感器件往往使用In97Ag3焊料进行锗窗口的真空密封,既能拉开芯片焊接的温度梯度,又能保证管壳的密封性能和内部的真空度要求。但由于In焊料的良好润湿性能和易氧化特性,工艺过程中常常出现焊料缝、焊料结球和漏气等外观或者气密不良的问题。本文系统地分析了In97Ag3焊料和锗窗的密封工艺参数对密封结果的影响。从焊料设计、模具设计、压力选择和焊接工艺曲线优化等方面进行研究,结果表明,锗窗口密封工艺在真空环境下加入还原性甲酸气氛,并选择倒装形式的模具设计,再结合优化后的焊接温度曲线,可以实现管壳的密封外观和性能的改善,从而大大提高In97Ag3焊料和锗窗的密封工艺的成品率和生产效率,对降低产品成本和提升企业核心竞争力意义重大。Infrared sensor components often use In97Ag3 solder for vacuum sealing of germanium windows,which can not only open the temperature gradient of chip welding,but also ensure the sealing performance of the tube shell and the internal vacuum degree requirements.However,due to the excellent wetting performance and easy oxidation characteristics of In solder,poor appearance or airtightness problems such as solder seams,solder balling,and gas leakage often occur during the process.This article systematically analyzes the influence of sealing process parameters of In97Ag3 solder and germanium window on sealing results.Research has been conducted on solder design,mold design,pressure selection,and optimization of welding process curves.The results show that the sealing process of germanium windows can be improved by adding a reducing formic acid atmosphere in a vacuum environment and selecting an inverted mold design.Combined with the optimized welding temperature curve,the sealing appearance and performance of the shell can be improved,greatly improving the yield and production efficiency of In97Ag3 solder and germanium window sealing process.This is of great significance for reducing product costs and enhancing the core competitiveness of enterprises.

关 键 词：In97Ag3焊料 锗窗 真空密封 

分 类 号：TN214[电子电信—物理电子学]