BN表面改性及其在导热聚氨酯灌封胶中的应用  

Surface modification of BN and application in thermal conductive polyurethane potting sealant

作　　者：孙双双 吴阳 孙茂 蔺红桃 王传增 王鸣 陈淑海 SUN Shuang-shuang;WU Yang;SUN Mao;LIN Hong-tao;WANG Chuan-zeng;WANG Ming;CHEN Shu-hai(School of Chemistry and Chemical Engineering,Shandong University of Technology,Zibo 255000,China)

机构地区：[1]山东理工大学化学化工学院,山东淄博255000

出　　处：《现代化工》2024年第6期146-149,155,共5页Modern Chemical Industry

基　　金：山东省自然科学基金(ZR2020MB054)。

摘　　要：以蓖麻油和多亚甲基多苯基多异氰酸酯(PAPI)为主要原料,通过改性剂KH-550对导热填料六方氮化硼(h-BN)进行改性制备导热聚氨酯灌封胶,并研究了改性BN(k-BN)对灌封胶性能的影响。结果表明,h-BN改性处理有效改善了其在聚氨酯灌封胶中的分散性并且降低基料的黏度;k-BN的加入显著提高了灌封胶的导热性能。当k-BN填充质量分数为50%时,导热系数为0.51 W/(m·K),比纯PU提高了180%,且较好地维持了灌封胶材料的力学性能,能够满足灌封胶对强度及形变的要求。热重(TG)分析结果表明填充k-BN后灌封胶的热稳定性得到提升。Taking castor oil and polymethylene polyphenyl polyisocyanate(PAPI)as main raw materials,a kind of high thermal conductivity polyurethane potting sealant is prepared through modifying hexahexagonal boron nitride(h-BN),a thermal conductive filler,by KH-550 silane.The influences of modified k-BN on the performance of potting sealant are studied.Results demonstrate that h-BN modification enhances effectively k-BN's dispersibility in polyurethane potting sealant and reduces the viscosity of matrix material.The addition of k-BN improves significantly the thermal conductivity of potting sealant.With a k-BN filling mass fraction of 50%,the thermal conductivity of the prepared sealant is 0.51 W/(m·K),which is 180%higher than that of pure polyurethane.Furthermore,the mechanical property of the prepared sealant is well maintained to meet strength and deformation requirements for potting sealant application.Thermogravimetric analysis reveals an improved thermal stability after k-BN filling.

关 键 词：聚氨酯 灌封胶 改性 导热 

分 类 号：TB332[一般工业技术—材料科学与工程]