大景深显微镜的实现方式  

Large Depth of Field Microscope Realization

作　　者：刘冰鑫 李康平 周占福[1] LIU Bingxin;LI Kangping;ZHOU Zhanfu(The 45th Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2024年第3期33-36,63,共5页Equipment for Electronic Products Manufacturing

摘　　要：大景深显微镜能够在不同焦平面上获取清晰的图像,为晶圆的对准提供了强大的支持。为了扩展景深,研究人员提出了多种技术,包括缩小系统孔径、波前编码和光学切趾等。提出了一种扩展景深的新方法,即双焦点物镜对准,该方法操作简单直观,并且可以直接采集对准标记来实现对准,从而极大地提高了对准的准确性和效率。这些技术和方法为大景深显微镜的后续研究奠定了坚实的基础。Large depth-of-field microscopes are capable of acquiring clear images at different focal planes,providing strong support for wafer alignment.To extend the depth of field,researchers have proposed a variety of techniques,including reducing the system aperture,wavefront encoding,and optical toe-cutting.In this paper,a new method to extend the depth of field is proposed,i.e.,bifocal objective lens alignment,which is simple and intuitive to operate and allows direct acquisition of alignment markers to achieve alignment,thus greatly improving the accuracy and efficiency of alignment.These techniques and methods lay a solid foundation for the subsequent research of large depth-of-field microscopy.

关 键 词：集成电路制造 显微镜 大景深 双焦点物镜对准 

分 类 号：TN305[电子电信—物理电子学]