退火温度对小变形拉拔Cu-0.08Ag合金组织性能的影响  

Effect of Annealing Temperature on Microstructure and Properties of Cu-0.08Ag Alloy with Small Deformation

作　　者：朱亚丹 田文斌 齐林 蔡佳 任玉平 李洪晓[1,2] 蒋敏 秦高梧[1,2] ZHU Yadan;TIAN Wenbin;QI Lin;CAI Jia;REN Yuping;LI Hongxiao;JIANG Min;QIN Gaowu(School of Materials Science and Engineering,Northeastern University,Shenyang 110819,China;Key Laboratory for Anisotropy and Texture of Materials(Ministry of Education),Northeastern University,Shenyang 110819,China)

机构地区：[1]东北大学材料科学与工程学院,沈阳110819 [2]东北大学材料各向异性与织构教育部重点实验室,沈阳110819

出　　处：《精密成形工程》2024年第6期164-172,共9页Journal of Netshape Forming Engineering

基　　金：国家重点研发计划(2021YFB3803101);沈阳市重大科技创新研发计划(Y19-1-005)。

摘　　要：目的在分析变形量为25%的小变形拉拔加工Cu-0.08Ag合金组织与性能的基础上,研究不同退火温度对小变形拉拔Cu-0.08Ag合金微观组织、力学性能和导电性能的影响规律,为Cu-Ag合金电磁线漆包工艺的制定提供参考。方法利用电子背散射衍射(EBSD)技术对Cu-0.08Ag合金小变形拉拔及200~500℃不同温度退火1 h后的样品进行组织表征,结合显微硬度计、拉伸试验机和电阻计等手段对性能进行综合分析。结果经变形量为25%的小变形拉拔后,Cu-0.08Ag合金等轴晶组织部分晶粒沿变形方向被拉长,<111>和<100>取向占比均增大,应力集中分布在<111>晶粒内,屈服强度提高了270%,而电导率仅下降了4.1%IACS。小变形拉拔Cu-0.08Ag合金的软化温度为350℃。与小变形拉拔态相比,在300℃及以下退火时显微组织和力学性能未发生明显变化,而电导率提升了2.9%IACS。在400℃及以上退火时,无畸变的等轴晶粒取代变形晶粒,并产生大量的退火孪晶,晶粒取向随机分布,力学性能和电导率与小变形拉拔前的相当。结论在300℃以下退火后,小变形拉拔Cu-0.08Ag合金在保持较高屈服强度的同时,其电导率也获得了提升,可获得强度和电导率良好的匹配关系。The work aims to study the effects of different annealing temperature on the microstructure,mechanical and elec-trical properties of Cu-0.08Ag alloy based on the analysis of the microstructure and properties of Cu-0.08Ag alloy with a small deformation of 25%by drawing process,so as to provide insights for the formulation of Cu-Ag alloy electromagnetic wire coat-ing process.The microstructure of Cu-0.08Ag alloy after small deformation drawing and annealing at different temperature ranging from 200-500℃for 1 hour was characterized by electronic backscattering diffraction(EBSD)technique.The micro-hardness,tensile properties and resistance properties of Cu-0.08Ag alloy were analyzed by means of microhardness tester,ten-sile tester and resistance meter.The results showed that some grains of Cu-0.08Ag alloy were elongated along the deformation direction after a small deformation of 25%.The proportion of<111>and<100>orientation grains increased while the internal stress distribution was concentrated in<111>grains.The yield strength increased by 270%,and the conductivity decreased by 4.1%IACS.The softening temperature of Cu-0.08Ag alloy after small deformation was 350℃.The microstructure and m℃e-chanical properties did not change significantly when the Cu-0.08Ag alloy was annealed below 300,and its conductivity i℃n-creased by 2.9%IACS compared with the small deformation drawn state.When the as-deformed Cu-0.08Ag alloy was annealed at 400 and above,the undistorted equiaxed grains replaced the deformed grains,a large number of annealing twins were pr℃o-duced,and the grain orientation was randomly distributed.Moreover,the mechanical properties and conductivity returned to the values before the small deformation.Therefore,annealing below 300℃of the as-deformed Cu-0.08Ag alloy can improve the conductivity significantly while maintaining high yield strength.The results are in a good balance between strength and conduc-tivity.

关 键 词：CU-AG合金 退火温度 显微组织 力学性能 电导率 

分 类 号：TG146.11[一般工业技术—材料科学与工程]