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作 者:马红磊 彭进[1] 王园园[1] 张琳琪[1] 郭星宇 陈亚超 MA Hong-lei;PENG Jin;WANG Yuan-yuan;ZHANG Lin-qi;GUO Xing-yu;CHEN Ya-chao(School of Materials Science and Engineering,Henan University of Technology,Zhengzhou 450001,China;Zhengzhou Hai Scientific Research Grinding Tool Co.,Ltd.,Zhengzhou 450100,China)
机构地区:[1]河南工业大学材料科学与工程学院,河南郑州450001 [2]郑州海科研磨工具有限公司,河南郑州450100
出 处:《热固性树脂》2024年第2期42-47,共6页Thermosetting Resin
基 金:河南省科技攻关项目(212102210643)。
摘 要:为解决传统树脂结合剂耐热性不高及与低熔点金属温度匹配性差的问题,以2,2′-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)和均苯四甲酸酐(PMDA)为单体,通过两步合成法制备聚酰亚胺树脂(PI),通过调控反应参数发现加料顺序为先胺后酐,反应时间6 h,单体PMDA与BAPP物质的量比为1.02∶1时,PI分子质量最佳,具有较好的力学性能(纯PI结合剂弯曲强度达95 MPa)和热稳定性(初始分解温度约510℃)。其与低熔点铜合金制备复合结合剂时,具有较好的成型温度匹配性和耐热性,当树脂体积分数为10%时,PI及聚酰胺酸复合结合剂的弯曲强度分别为532 MPa和540 MPa,综合性能较佳。In order to solve the problems of low heat resistance and poor temperature matching with low melting point metals in traditional resin binders,polyimide resin(PI)was prepared by two-step synthesis method using 2,2′-bis[4-(4-aminophenoxy)phenyl]propane(BAPP)and phthalic anhydride(PMDA)as monomers.By adjusting the reaction parameters,it was found that the feeding order was amine followed by anhydride,and the reaction time was 6 h.When the molar ratio of monomer PMDA to BAPP was 1.02∶1,the molecular weight of PI was optimal.It had good mechanical properties(pure PI binder with a flexural strength of 95 MPa)and thermal stability(initial decomposition temperature of about 510℃).When preparing composite binders with low melting point copper alloys,it had good temperature matching and heat resistance.When the resin volume fraction was 10%,the flexural strength of PI and polyamide acid composite binder was 532 MPa and 540 MPa,respectively,with better comprehensive performance.
关 键 词:聚酰亚胺 耐高温 复合结合剂 低熔点金属合金 弯曲强度 热稳定性
分 类 号:TB323.6[一般工业技术—材料科学与工程]
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