Influence of sintering time on microstructure and properties of hot oscillatory pressing sintered W–Cu refractory alloys  被引量:1

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作  者:Zi-Qian Wu Wei Zhao Ka Gao Shi-Hao Du Qing-Quan Kong De-Jian Sun Yang Gao 

机构地区:[1]School of Materials Science and Engineering,Zhengzhou University of Aeronautics,Zhengzhou 450015,China [2]School of Mechanical Engineering,University of Shanghai for Science and Technology,Shanghai 200093,China [3]Department of General Medicine,Changhai Hospital,Shanghai 200000,China [4]Hubei Key Laboratory of Mechanical Transmission and Manufacturing Engineering,Wuhan University of Science and Technology,Wuhan 430081,China [5]Sichuan Province Engineering Technology Research Center of Powder Metallurgy,Chengdu University,Chengdu 610106,China

出  处:《Tungsten》2024年第2期323-332,共10页钨科技(英文)

基  金:supported by National Natural Science Foundation of China(51904277);the Open Fund of Sichuan Province Engineering Technology Research Center of Powder Metallurgy,Chengdu University(SC-FMYJ2023-02);Opening Foundation of Key Laboratory of Advanced Manufacture Technology for Automobile Parts,Ministry of Education(2022 KLMT05);the Open Fund of Hubei Key Laboratory of Mechanical Transmission and Manufacturing Engineering at Wuhan University of Science and Technology(MTMEOF2022B02);Fund of Key Laboratory of Advanced Materials of Ministry of Education(ADV22-20);Training Program for Young Backbone Teachers in Colleges and University of Henan Province(2020GGJS171);Fund of Zhengzhou University of Aeronautics Graduate Education Innovation Program of China(2022CX57).

摘  要:W–Cu refractory alloys are widely used in aerospace,aviation,electronics,power,and other fi elds.However,because of its large melting point diff erence between alloy elements,the conventional powder metallurgy method required a long time of high temperature sintering is very likely to cause low density and abnormal grain size growth.Therefore,90W-10Cu refractory alloys were successfully prepared by hot oscillatory pressing(HOP)under diff erent sintering time in this work.Then the infl uence of sintering time on the microstructure,grain size,density,Vickers hardness,room-tensile property,and electrical conductivity of the W–Cu refractory alloy was systematically invested.The results showed that during the short sintering time(30–90 min),the density,Vickers hardness,tensile strength,and electrical conductivity of the W–Cu refractory alloy increased signifi cantly to 98.7%,163.29 HV 30,507.3 MPa,and 14.2%International Annealed Copper Standard with the sintering time increasing,respectively,while its grain size showed no obvious change.When the sintering time further increased to 120 min,the density was basically consistent with the sintering time of 90 min.Nevertheless,the prolonged high temperature sintering resulted in the grain growth of the samples,which caused the deterioration of the Vickers hardness,room-tensile strength,and conductivity properties of the W–Cu refractory alloy.At the same sintering time,the density,Vickers hardness,and electrical conductivity of the HOP sintered W–Cu refractory alloy were signifi cantly higher than those of the HP sintered sample.It was indicated that high density,fi ne-grain,and excellent properties W–Cu refractory alloys could be prepared by hot oscillatory pressing under appropriate sintering time.

关 键 词:W–Cu refractory alloy Hot oscillatory pressing Sintering time Microstructure Property 

分 类 号:TG132[一般工业技术—材料科学与工程]

 

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