Energy beam-based direct and assisted polishing techniques for diamond:A review  

作　　者：Zhuo Li Feng Jiang Zhengyi Jiang Zige Tian Tian Qiu Tao Zhang Qiuling Wen Xizhao Lu Jing Lu Hui Huang 

机构地区：[1]Institute of Manufacturing Engineering,Huaqiao University,Xiamen 361021,People’s Republic of China [2]School of Mechanical,Materials,Mechatronic and Biomedical Engineering,University of Wollongong,Wollongong,NSW 2522,Australia [3]College of Mechanical Engineering and Automation,Huaqiao University,Xiamen 361021,People’s Republic of China [4]State Key Laboratory of High Performance Tools,Huaqiao University,Xiamen 361021,People’s Republic of China

出　　处：《International Journal of Extreme Manufacturing》2024年第1期93-124,共32页极端制造（英文）

基　　金：sponsored by the National Natural Science Foundation of China(Nos.51835004,U22A20198);the Major Science and Technology Projects in Henan Province(221100230300);the 111 Project(No.B23011)。

摘　　要：Diamond is a highly valuable material with diverse industrial applications,particularly in the fields of semiconductor,optics,and high-power electronics.However,its high hardness and chemical stability make it difficult to realize high-efficiency and ultra-low damage machining of diamond.To address these challenges,several polishing methods have been developed for both single crystal diamond(SCD)and polycrystalline diamond(PCD),including mechanical,chemical,laser,and ion beam processing methods.In this review,the characteristics and application scope of various polishing technologies for SCD and PCD are highlighted.Specifically,various energy beam-based direct and assisted polishing technologies,such as laser polishing,ion beam polishing,plasma-assisted polishing,and laser-assisted polishing,are summarized.The current research progress,material removal mechanism,and infuencing factors of each polishing technology are analyzed.Although some of these methods can achieve high material removal rates or reduce surface roughness,no single method can meet all the requirements.Finally,the future development prospects and application directions of different polishing technologies are presented.

关 键 词：single crystal diamond polycrystalline diamond energy beam polishing technology material removal mechanism influencing factors 

分 类 号：TQ163[化学工程—高温制品工业]