表面负载还原氧化石墨烯对泡沫铜热扩散系数的影响  

Effect of surface-loaded reduced graphene oxide on the thermal diffusion coefficient of foam copper

作　　者：常红旭 孙立伟 白亮 刘景顺[1] 刘军[1,2] CHANG Hongxu;SUN Liwei;BAI iang;LIU Jingshun;LIU Jun(School of Materials Science and Engineering,Inner Mongolia University of Technology,Hohhot 010051,China;Inner Mongolia Key Laboratory of Graphite and Graphene for Energy Storage and Coating,Inner Mongolia University of Technology,Hohhot 010051,China)

机构地区：[1]内蒙古工业大学材料科学与工程学院,呼和浩特010051 [2]内蒙古工业大学内蒙古自治区石墨(烯)储能与涂料重点实验室,呼和浩特010051

出　　处：《内蒙古工业大学学报（自然科学版）》2024年第3期213-218,共6页Journal of Inner Mongolia University of Technology：Natural Science Edition

基　　金：内蒙古自治区自然科学基金项目(2020LH05010);内蒙古工业大学材料学重点学科团队项目(ZD202012);内蒙古自治区直属高校基本科研业务费项目(JY20220260)。

摘　　要：为研究及提升泡沫铜的热扩散性能,利用不同溶剂制备氧化石墨烯混合溶液,通过机械沉积(GO-无水乙醇-丙酮混合溶液沉积)、电沉积(GO-CuS4O混合溶液电沉积、KH550改性GO电沉积)两种不同的沉积方法将氧化石墨烯(GO)附着到经过预处理的泡沫铜表面,后通过高温还原法去除氧化石墨烯表面多余的含氧基团,将其还原为还原氧化石墨烯(rGO),研究材料热扩散性能及泡沫铜表面rGO的存在状态。研究结果表明,通过GO-无水乙醇-丙酮混合溶液沉积的泡沫铜表面沉积层最为均匀完整,经高温还原后性能提升也最为明显,其低温热扩散系数由纯泡沫铜的29.06 mm^(2)/s提高为56.81 mm^(2)/s,提升了95.5%。与热扩散系数为50.26 mm^(2)/s的T2铜片相比,其热扩散系数亦提高13.09%。GO在泡沫铜表面的沉积方式对沉积效果影响显著,GO经过高温还原为rGO后均可以有效提升泡沫铜的热扩散性能。To study and improve the thermal conductivity of copper foam,different solvents were used to dissolve the mixed solution of graphene oxide.Graphene oxide(GO)was attached to the surface of pretreated copper foam by two different deposition methods of mechanical deposition and electrodeposition.Then,by using a high-temperature reduction method,the excess oxygen-containing functional groups on the surface of graphene oxide were removed,and it was reduced to reduced graphene oxide(rGO).The thermal conductivity of the material and the existence of rGO on the surface of copper foam were studied.The results show that the deposition layer on the surface of copper foam deposited by GO-anhydrous ethanol-acetone mixed solution is the most uniform and complete,and the performance improvement is also the most obvious after high temperature reduction.The low temperature thermal diffusion coefficient is increased by 95.5%,from 29.06 mm^(2)/s of pure copper foam to 56.81 mm^(2)/s.Compared with T2 copper sheet with thermal diffusivity of 50.26 mm^(2)/s,its thermal diffusivity is also increased by 13.09%.The deposition method of GO on the surface of copper foam has a significant effect on the deposition effect.After high temperature reduction of GO to rGO,the thermal conductivity of copper foam can be effectively improved.

关 键 词：泡沫铜 氧化石墨烯 沉积层 高温还原 热扩散系数 

分 类 号：TG146.11[一般工业技术—材料科学与工程]