(Zr,Ti)O_(4)基微波薄膜介质基片制备关键工艺研究  

Research on the Key Process of Preparation of(Zr,Ti)O_(4)-based Microwave ThinFilm Dielectric Substrates

作　　者：江俊俊 康建宏 汪小玲 刘杨琼 赵杨军 JIANG Junjun;KANG Jianhong;WANG Xiaoling;LIU Yangqiong;ZHAO Yangjun(Chengdu Hongke Electronic Technology Co.,Ltd,Chengdu 610100,China)

机构地区：[1]成都宏科电子科技有限公司,成都610100

出　　处：《材料导报》2024年第S01期42-46,共5页Materials Reports

摘　　要：素坯成型工艺对微波陶瓷材料在微波薄膜介质基片产品中的工程化应用具有关键影响。目前关于(Zr,Ti)O_(4)主晶相系统微波介质陶瓷材料的研究主要集中在降低(Zr,Ti)O_(4)陶瓷烧结温度、掺杂改性优化其介电性能、Q×f值(品质因数与频率的乘积)等配方优化方面。本文以(Zr,Ti)-O4基微波陶瓷材料为原材料,通过研究中介微波薄膜介质基片关键成型工艺对其物相结构、微观形貌和介电性能的影响,发现不同素坯成型工艺方式对(Zr,Ti)O_(4)基陶瓷的致密度、介质损耗值、Q×f值等影响显著。采用方式四进行薄膜介质基片的制备,获得的(Zr,Ti)O_(4)基薄膜介质基片致密度较高,气孔率低,陶瓷材料的介质损耗低至1.1×10^(-4),15 GHz下Q×f值高达50000。本文通过对不同素坯成型方式的研究,以期为(Zr,Ti)O_(4)基微波陶瓷材料薄膜介质基片的工程化应用提供理论支撑。The green molding process has a key impact on the engineering application of microwave ceramic materials in microwave thin film dielectric substrate products.At present,the research on microwave dielectric ceramic materials of(Zr,Ti)O_(4) main crystal phase system mainly focused on the optimization of formulations such as reducing the sintering temperature of(Zr,Ti)O_(4) ceramics,doping modification to optimize dielectric properties and Q×f value.In this paper,the(Zr,Ti)O_(4)-based microwave ceramic material was used as raw material,and the effects of the key molding process of the intermediary microwave thin film dielectric substrate on the phase structure,microscopic morphology and dielectric properties were studied,and it was found that different green molding methods had significant effects on the density,dielectric loss value and Q×f value of(Zr,Ti)O_(4)-based ceramics.To prepare the thin film dielectric substrate with method 4,and the obtained(Zr,Ti)O_(4) based thin film dielectric substrate has high density,significantly low porosity,the dielectric loss of ceramic materials is as low as 1.1×10^(-4),and the Q×f value is as high as about 50000 tested at 15 GHz.In this paper,we provide support for the engineering application of(Zr,Ti)O_(4)-based microwave ceramic thin film dielectric substrates through the study of different green molding methods of key processes.

关 键 词：(Zr Ti)O_(4) 薄膜介质基片 工程化应用 微波陶瓷材料 成型工艺 介电性能 

分 类 号：TB34[一般工业技术—材料科学与工程]