Al_(2)O_(3)含量对PTFE/SiO_(2)复合薄膜性能的影响  

Effect of Al_(2)O_(3) Content on Performances of PTFE/SiO_(2) Composite Films

作　　者：李强[1] 金霞 王维文 冯春明 LI Qiang;JIN Xia;WANG Wei-wen;FENG Chun-ming(The 46th Research Institute of China Electronics Technology Group Corporation,Tianjin 300220,China)

机构地区：[1]中国电子科技集团公司第四十六研究所,天津300220

出　　处：《塑料科技》2024年第5期58-61,共4页Plastics Science and Technology

摘　　要：多层电路板存在散热性能较差的问题,限制其在高频电路中的应用。实验以Al_(2)O_(3)为填料,制备了聚四氟乙烯(PTFE)/SiO_(2)高导热复合薄膜材料,用于增强多层电路板的导热性能。将不同添加量的Al_(2)O_(3)加入PTFE中,采用浸渍工艺结合高温烧结制备PTFE/SiO_(2)复合薄膜,研究Al_(2)O_(3)含量对PTFE/SiO_(2)复合薄膜的微观形貌、密度、导热性能、力学性能的影响。结果表明:随着Al_(2)O_(3)含量的提高,复合薄膜的导热系数呈现上升趋势,密度和力学强度均呈现先升高后下降的趋势。当Al_(2)O_(3)含量为4%时,PTFE/SiO_(2)复合薄膜(样品3)的微观缺陷最少,具有最高的密度和力学强度,同时具有较为合理的导热系数和电绝缘性。样品3的密度为2.119 g/cm^(3),力学强度为17.3 MPa,导热系数为0.98 W/(m·K),体积电阻率为380.9 GΩ·m。Multi-layer circuit board has the problem of poor heat dissipation performance,which limits its application in high frequency circuit.In this experiment,polytetrafluoroethylene(PTFE)/SiO_(2) high thermal conductivity composite film materials were prepared with Al_(2)O_(3) as filler to enhance the thermal conductivity of multi-layer circuit boards.PTFE/SiO_(2) composite films were prepared by impregnation process combined with high temperature sintering by adding different amounts of Al_(2)O_(3) into PTFE.The effects of Al_(2)O_(3) content on the microstructure,density,thermal conductivity and mechanical properties of PTFE/SiO_(2) composite films were studied.The results show that with the increase of Al_(2)O_(3) content,the thermal conductivity of the composite film shows an upward trend,and the density and mechanical strength show a trend of increasing first and then decreasing.When the Al_(2)O_(3) content is 4%,the PTFE/SiO_(2) composite film(sample 3)has the least micro-defects,the highest density and mechanical strength,and has a reasonable thermal conductivity and electrical insulation.The density of sample 3 is 2.119 g/cm^(3),the mechanical strength is 17.3 MPa,the thermal conductivity is 0.98 W/(m·K),and the volume resistivity is 380.9 GΩ·m.

关 键 词：三氧化二铝 PTFE 导热性能 力学性能 体积电阻率 

分 类 号：TM211[一般工业技术—材料科学与工程]