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作 者:屈恒泽 张胜利 曹江 吴振华 柴扬 李卫胜 李连忠 任文才 王欣然 曾海波 Hengze Qu;Shengli Zhang;Jiang Cao;Zhenhua Wu;Yang Chai;Weisheng Li;Lain-Jong Li;Wencai Ren;Xinran Wang;Haibo Zeng(MIIT Key Laboratory of Advanced Display Materials and Devices,College of Material Science and Engineering,Nanjing University of Science and Technology,Nanjing 210094,China;School of Electronic and Optical Engineering,Nanjing University of Science and Technology,Nanjing 210094,China;Key Laboratory of Microelectronics Device and Integrated Technology,Institute of Microelectronics of Chinese Academy of Sciences,Beijing 100029,China;Department of Applied Physics,The Hong Kong Polytechnic University,Hong Kong 999077,China;National Laboratory of Solid State Microstructures,School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures,Nanjing University,Nanjing 210023,China;Department of Mechanical Engineering,The University of Hong Kong,Hong Kong 999077,China;Shenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China;School of Integrated Circuits,Nanjing University,Suzhou 215163,China;Suzhou Laboratory,Suzhou 215009,China)
机构地区:[1]MIIT Key Laboratory of Advanced Display Materials and Devices,College of Material Science and Engineering,Nanjing University of Science and Technology,Nanjing 210094,China [2]School of Electronic and Optical Engineering,Nanjing University of Science and Technology,Nanjing 210094,China [3]Key Laboratory of Microelectronics Device and Integrated Technology,Institute of Microelectronics of Chinese Academy of Sciences,Beijing 100029,China [4]Department of Applied Physics,The Hong Kong Polytechnic University,Hong Kong 999077,China [5]National Laboratory of Solid State Microstructures,School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures,Nanjing University,Nanjing 210023,China [6]Department of Mechanical Engineering,The University of Hong Kong,Hong Kong 999077,China [7]Shenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China [8]School of Integrated Circuits,Nanjing University,Suzhou 215163,China [9]Suzhou Laboratory,Suzhou 215009,China
出 处:《Science Bulletin》2024年第10期1427-1436,共10页科学通报(英文版)
基 金:supported by the Postgraduate Research&Practice Innovation Program of Jiangsu Province(KYCX22_0428);the Training Program of the Major Research Plan of the National Natural Science Foundation of China(91964103);the Natural Science Foundation of Jiangsu Province(BK20180071);the Fundamental Research Funds for the Central Universities(30919011109);sponsored by Qing Lan Project of Jiangsu Province,and the Six Talent Peaks Project of Jiangsu Province(XCL-035);Research Grant Council of Hong Kong(CRS_PolyU502/22).
摘 要:Developing low-power FETs holds significant importance in advancing logic circuits,especially as the feature size of MOSFETs approaches sub-10 nanometers.However,this has been restricted by the thermionic limitation of SS,which is limited to 60 mV per decade at room temperature.Herein,we proposed a strategy that utilizes 2D semiconductors with an isolated-band feature as channels to realize subthermionic SS in MOSFETs.Through high-throughput calculations,we established a guiding principle that combines the atomic structure and orbital interaction to identify their sub-thermionic transport potential.This guides us to screen 192 candidates from the 2D material database comprising 1608 systems.Additionally,the physical relationship between the sub-thermionic transport performances and electronic structures is further revealed,which enables us to predict 15 systems with promising device performances for low-power applications with supply voltage below 0.5 V.This work opens a new way for the low-power electronics based on 2D materials and would inspire extensive interests in the experimental exploration of intrinsic steep-slope MOSFETs.
关 键 词:2D materials Electronic band structures Transport properties Steep-slope transistors DFT-NEGF calculations
分 类 号:TN386[电子电信—物理电子学]
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