COMSOL模拟电铸过程铜沉积制备微型探针针管  

COMSOL Simulated Cu Deposition in Electroforming Process to Prepare Miniature Probe

作　　者：杨西荣[1,2] 王苗 刘晓燕[1,2] 李兆 罗雷[1,2] 何晓梅 Yang Xirong;Wang Miao;Liu Xiaoyan;Li Zhao;Luo Lei;He Xiaomei(School of Metallurgical Engineering,Xi'an University of Architecture and Technology,Xi'an 710055,China;Key Laboratory of Gold and Resources of Shaanxi Province,Xi'an 710055,China;School of Materials Engineering,Xi'an Aeronautical University,Xi'an 710077,China)

机构地区：[1]西安建筑科技大学冶金工程学院,陕西西安710055 [2]陕西省黄金与资源重点实验室,陕西西安710055 [3]西安航空学院材料工程学院,陕西西安710077

出　　处：《稀有金属》2024年第3期388-397,共10页Chinese Journal of Rare Metals

基　　金：国家自然科学基金项目(51474170);陕西省教育厅重点实验室项目(20JS075)资助。

摘　　要：仿真模拟预测电铸过程中铸造层的厚度变化是指导生产降低成本、提升电铸质量的重要方式。微型探针针管由于尺寸小、表面及理化性能要求高,一直是材料制备过程的难点。通过电化学测试确定模型输入参数,利用COMSOL软件电镀模块对电铸沉积过程进行了仿真,模拟电铸阴极表面电流密度(I)分布,探究了不同电流密度下铸层达到相同厚度时的沉积时间,并计算了模拟沉积速率。利用扫描电镜(SEM)和白光干涉仪研究了实际制备过程中样品的表面形貌和粗糙度,并与模拟过程进行了对比,结果表明:在焦磷酸盐电铸铜的体系下,当反应温度为35℃,体系pH为8.6±0.1时,I取3.5 A·dm^(-2),预测厚度达到90μm时,电铸过程中铸层厚度误差和反应时间误差最小,分别为0.55%和5.00%,此时样品铸层表面最为致密,放大后表面晶粒细小、结合紧密,且粗糙度最小、表面质量最高。模拟结果与实验结果具有良好的一致性,表明利用COMSOL模拟电铸过程铜沉积制备微型探针是可行的。Simulation of the thickness change of the casting layer during the electroforming process is an important way to guide production to reduce costs and improve the quality of electroforming.Micro-electroforming technology is a metal micro-structure preparation technology.Compared with ordinary mechanical processing,it can obtain high-purity micron products with precise dimensions and smooth surface.Due to its small size,high surface and physical and chemical performance requirements,the micro-probe has always been a difficult point in the material preparation process.It is feasible to prepare the probe tube by the micro-electroforming process,but the uneven current density distribution leads to the difference in the thickness of the electroforming layer which restricts the improvement of the quality of the probe tube.A combination of simulation and experiment is used to explore the preparation process of the micro copper tube.After demolding,a probe tube with a certain strength that can support the probe is obtained,the surface is flat and compact,the roughness meets the requirements of use,and the signal transmission is not hindered.Choose copper as the electroforming deposition metal,and configure the electroforming liquid with copper pyrophosphate as the main salt.Determine the polarization curve through electrochemical tests and determine the model input parameters.Use the COMSOL electroplating module to use the"secondary current distribution"interface to establish the electroforming flow field and electric field model,and simulate the flow field mass transfer in the electroforming copper process.The current density distribution on the surface of the electroforming cathode was simulated,and the deposition time when the cast layer reached the same thickness under different current densities was explored.Under the same exploration process,the micro-probe needle tube was prepared through experiments,and the surface morphology and roughness of the samples in the actual preparation process were studied by scanning e

关 键 词：电铸铜 微型探针针管 COMSOL 铸层厚度 组织形貌 

分 类 号：TQ153.4[化学工程—电化学工业]