一种降低电流密度的过孔设计方法  

A Via Design Method for Reducing Current Density

作　　者：张子春 刘婷婷 杨开泰 Zhang Zichun;Liu Tingting;Yang Kaitai(Xi’an Aeronautics Computing Technique Research Institute,AVIC,Xi’an Shaanxi 710065,China)

机构地区：[1]中国航空工业集团公司西安航空计算技术研究所,陕西西安710065

出　　处：《山西电子技术》2024年第3期30-31,34,共3页Shanxi Electronic Technology

摘　　要：针对高密度PCB板低压大电流电源网络设计中局部电流密度较大,导致集成电路无法正常工作的问题,将电流密度理论与PCB中过孔设计实例相结合,提出通过调整过孔位置降低高速印制电路板中电流密度的方法。通过调整过孔位置解决电流密度超标的实例,树立过孔位置影响电源完整性的意识,帮助研发人员解决低压大电流的PCB设计问题。In order to solve the problem that the integrated circuit cannot work normally due to the high local current density of the low-voltage and high-current power supply network in the design of high density PCB board,combining the current density theory with the design example of the hole in PCB,a method is proposed to solve the current density in high speed printed circuit board by adjusting the via position.Combined with the example of adjusting the via position to reduce the current density,the awareness of the influence of the via distribution on the integrity of the power supply is established,and help the personnel to solve the PCB design problem of low voltage and high current.

关 键 词：电源完整性 电流密度 过孔 

分 类 号：TN4[电子电信—微电子学与固体电子学]