车规半导体集成电路在装备领域的适用性探讨  

Research on the Applicability of Automotive Semiconductor Integrated Circuits in the Equipment Field

作　　者：庞水全 龚陈茵 王之哲 李元晟 罗军 王斌 PANG Shuiquan;GONG Chenyin;WANG Zhizhe;LI Yuansheng;LUO Jun;WANG Bin(CEPREI,Guangzhou 511730,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370

出　　处：《电子产品可靠性与环境试验》2024年第3期98-103,共6页Electronic Product Reliability and Environmental Testing

基　　金：广东省重点领域研发计划(2022B0701180002);工业和信息化部产业技术基础公共服务平台项目(2021-H021-1-1)资助。

摘　　要：为探究车规电子元器件在装备领域应用的可能性,通过对比军用半导体集成电路和车规半导体集成电路通用标准规范,重点分析了二者在质量保证要求、可靠性试验项目与试验方法方面的区别与联系,讨论了车规半导体集成电路应用在装备领域的可能性,并提出了建议与未来重点研究方向。该研究对我国装备领域的低成本、高可靠发展方向具有一定的借鉴意义。To explore the possibility of applying automotive electronic components in the field of equipment,by comparing the general standards and specifications of military semiconductor integrated circuits and automotive semiconductor integrated circuits,the differences and connections between their quality assurance requirements,reliability test items,and test methods are emphatically analyzed.The possibility of applying automotive semiconductor integrated circuits in the field of equipment is discussed,and suggestions and future research directions are proposed.This study has certain reference significance for the low-cost and highly reliable development direction in the field of equipment in China.

关 键 词：车规电子 军用电子 标准 装备领域 低成本 高可靠 

分 类 号：TN43[电子电信—微电子学与固体电子学] TB114.35[理学—概率论与数理统计]