双面研磨技术研究现状与发展趋势  

Recent Development and Prospective of Double-sided Lapping Technology

作　　者：郭江 潘博 连佳乐 杨哲[1] 刘欢[1] 高菲[1] 康仁科[1] GUO Jiang;PAN Bo;LIAN Jiale;YANG Zhe;LIU Huan;GAO Fei;KANG Renke(State Key Laboratory of High-performance Precision Manufacturing,Dalian University of Technology,Dalian 116024)

机构地区：[1]大连理工大学高性能精密制造全国重点实验室,大连116024

出　　处：《机械工程学报》2024年第7期266-288,共23页Journal of Mechanical Engineering

基　　金：国家重点研发计划资助项目(2022YFB3403300)。

摘　　要：近年来,随着半导体、光学制造等领域的飞速发展,对晶圆、光学窗口及密封环等薄平板件的需求越来越大,加工质量要求越来越高。双面研磨具有加工应力小、效率高等优点,被广泛用于薄平板件的加工。为梳理双面研磨技术发展现状,重点综述了双面研磨的机理、工艺、应用及装备的最新研究进展;分析了双面研磨理论模型对工艺的优化效果,总结了双面研磨工艺的应用现状。此外,全面比较了行业内代表性厂家双面研磨装备的技术水平,并指出了国内与国外的差距。在此基础上,对双面研磨技术的发展趋势进行了展望,为后续相关研究提供了参考。In recent years,semiconductor and optical manufacturing fields have experienced rapid development,leading to a heightened demand for thin flat components,such as wafers,optical windows,and sealing rings.Consequently,the quality requirements for their processing have become increasingly rigorous.Double-sided lapping is a widely used method for processing thin flat components,due to its low processing stress and high efficiency.To provide a comprehensive review of the current status of double-sided lapping,this study focuses on examining the mechanisms,processes,applications,and recent research developments in equipment.Additionally,the optimization effects of theoretical models on the double-sided lapping process are analyzed,and the current application status is summarized.Moreover,this study thoroughly compares the advantages and disadvantages of representative double-sided lapping equipment from various manufacturers in the industry,highlighting the gap between domestic and international equipment.The findings of this analysis offer a valuable reference for future research in the field and present a projection of the development trends of double-sided lapping technology.

关 键 词：双面研磨技术 材料去除 工艺优化 双面研磨装备 

分 类 号：TH166[机械工程—机械制造及自动化]