SiC陶瓷的磨削去除机理及参数对磨削力影响  

Removal Mechanism and Effect of Parameters on Grinding Force in Grinding SiC Ceramics

作　　者：周云光[1,2,3] 田川川 王书海 陈晗 ZHOU Yun-guang;TIAN Chuan-chuan;WANG Shu-hai;CHEN Han(School of Mechanical Engineering&Automation,Northeastern University,Shenyang 110819,China;AVIC SAC Commercial Aircraft Company Ltd.,Shenyang 110850,China;Qinhuangdao Ruifang Machinery Company Limited,Qinhuangdao 066000,China)

机构地区：[1]东北大学机械工程与自动化学院,辽宁沈阳110819 [2]中航沈飞民用飞机有限责任公司,辽宁沈阳110850 [3]秦皇岛瑞方机械有限公司,河北秦皇岛066000

出　　处：《东北大学学报（自然科学版）》2024年第4期548-554,共7页Journal of Northeastern University(Natural Science)

基　　金：国家自然科学基金资助项目(51905083,51975113);河北省自然科学基金资助项目(E2022501004);中央高校基本科研业务费专项资金资助项目(N2123025,N2203015);中国博士后科学基金资助项目(2021MD703912)。

摘　　要：为探究SiC陶瓷的磨削去除机理及磨削参数对磨削力影响规律,基于SPH(smoothed particle hydrodynamics)法建立了单磨粒冲击SiC陶瓷仿真模型,分析了SiC磨削裂纹产生和扩展机制;通过单因素试验分析了v_(s),v_(w)和a_(p)对SiC磨削去除机理、法向磨削力和切向磨削力的影响规律.结果表明,磨粒冲击导致中位裂纹和横向裂纹产生,随着磨粒压入深度的增加,横向裂纹向材料近表面区域扩展,当横向裂纹扩展至材料表面形成脆性断裂;随着v_(s)的增大,v_(w)和a_(p)的减小,磨削表面产生的凹坑区域和凹坑深度减小,塑性去除区域变大,法向磨削力和切向磨削力均呈减小趋势.研究成果为SiC构件的高效低损伤加工提供重要依据.In order to explore the removal mechanism and influence law of grinding force in grinding SiC ceramics,the simulation model of single abrasive striking SiC ceramics was established based on the SPH(smoothed particle hydrodynamics)method,and the crack generation and propagation mechanism during grinding SiC ceramics were analyzed;the effect of grinding velocity(v_(s)),feeding rate(v_(w))and grinding depth(a_(p))on the removal mechanism,the normal grinding force and tangential grinding force of grinding SiC ceramics were analyzed by the single factor experiment.The results showed that the abrasives striking the workpiece lead to the generation of the median cracks and the transverse cracks.With the increase of abrasive pressing depth,the transverse crack expands to the material surface,and when the transverse crack expands to the material surface,the brittle fracture occurs.With the increase of v_(s),the decrease of v_(w) and a_(p),and the decrease of the area and depth of the pits on the grinding surface,the plastic removal area becomes larger,and the normal grinding force and tangential grinding force both decrease.These results may provide an important basis for high‐efficiency and low‐damage machining of SiC ceramic components.

关 键 词：磨削 去除机理 磨削力 SIC陶瓷 SPH 

分 类 号：TH161[机械工程—机械制造及自动化]