干膜显影悬浮液产生原因分析  

Analysis of the causes of dry film development suspension

作　　者：李香华 樊锡超 邹金龙 刘飞艳 郑有能 LI Xianghua;FAN Xichao;ZOU Jinlong;LIU Feiyan;ZHENG Youneng(Jiangmen Suntak Circuit Technology Co.,Ltd.,Guangdong Intelligent Industrial Control Printed Circuit Board Engineering Technology Research Centre,Jiangmen 529000,Guangdong,China)

机构地区：[1]江门崇达电路技术有限公司,广东省智能工控印制电路板工程技术研究中心,广东江门529000

出　　处：《印制电路信息》2024年第6期19-21,共3页Printed Circuit Information

摘　　要：显影是印制电路板(PCB)线路图形制作的重要工序,显影液中滞留的干膜悬浮物极易造成产品线路短路缺陷并报废,造成生产成本上升。通过设计对比实验,对干膜显影悬浮液产生的原因进行了分析和探讨,有效降低短路不良率,以期为同行解决类似问题提供一定参考。Development is an important process in the production of printed circuit board(PCB)circuit pattern.The dry film matter suspended in the developing solution is very easy to cause short circuit defects in the product line,the formation of scrap,and the increase in production costs.This paper analyses and explores the causes of dry film development suspension by designing comparative experiments to effectively reduce the short circuit defective rate,hoping to provide some reference for similar problems.

关 键 词：印制电路板 显影 干膜悬浮物 线路图形 

分 类 号：TN41[电子电信—微电子学与固体电子学]