5G通信主板层压技术难点及对策  

Difficulties and countermeasures of lamination technology for 5G communication motherboard

作　　者：傅立红 唐缨 FU Lihong;TANG Ying(Guangdong Ellington Electronics Tech Co.,Ltd.,Zhongshan 528445,Guangdong,China)

机构地区：[1]广东依顿电子科技股份有限公司,广东中山528445

出　　处：《印制电路信息》2024年第6期26-30,共5页Printed Circuit Information

摘　　要：5G通信印制电路板(PCB)主板是5G基站的核心部件之一。主板良好的层压质量决定了5G通信信号在主板线路中传送的质量。根据一款5G通信主板的设计技术特点,从层压结构设计、基板材料的选用、层压流程制作中的技术要点等方面进行技术分析,给出相应的改善对策,并通过实验数据验证了改善对策的有效性。The printed circuit board(PCB)motherboard for 5G communication is one of the core components of 5G base station.The good lamination quality of the motherboard determines the transmission quality of 5G communication signals in the motherboard circuit.According to the design technical characteristics of a 5G communication motherboard,this paper makes technical analysis from the aspects of lamination structure design,selection of substrate materials and technical points in lamination process,and gives corresponding improvement measures.The effectiveness of the improvement measures is verified by experimental data,providing reference for lamination process of 5G communication motherboard.

关 键 词：主板 压合 插入损耗 转压点温度 

分 类 号：TN41[电子电信—微电子学与固体电子学]