基于波峰焊桥连改善的设计优化研究  

Research on design optimization based on wave soldering bridging improvement

作　　者：贺光辉[1] 何日吉 何骁 邹雅冰[1] 周舟 李伟明 HE Guanghui;HE Riji;HE Xiao;ZOU Yabing;ZHOU Zhou;LI Weiming(CEPREI,Guangzhou 510610,Guangdong,China)

机构地区：[1]中国赛宝实验室,广东广州510610

出　　处：《印制电路信息》2024年第6期52-55,共4页Printed Circuit Information

基　　金：民用飞机专项科研技术-质量和可靠性保证体系研究项目(MJZ2-3N21)。

摘　　要：波峰焊是一种常见的电装工艺焊接方式,而桥连是波峰焊工艺最为常见的焊接缺陷之一。介绍了波峰焊接桥连产生的机理,并分析了焊盘间距过近、引脚出脚长度过长,以及器件布局方向不当三种典型可制造性设计引起桥连的原因,并探讨了有助于波峰焊接桥连改善的可制造性设计优化方案。As a common soldering method of electric assembly process,wave soldering has to face bridging as one of the most common welding defects.In this paper,the mechanism of bridging is introduced,and three classic poor design for manufacturing(DFM)causes of bridging are analyzed,such as too close pad spacing,too long pin length and improper device layout direction.The optimization directions of DFM on bridging improvement are also discussed as a reference in industry.

关 键 词：波峰焊 桥连 可制造性设计 设计优化 

分 类 号：TN41[电子电信—微电子学与固体电子学]