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作 者:单东栋 王玲 秦颖楠[1,2] 管科 SHAN Dongdong;WANG Ling;QIN Yingnan;GUAN Ke(ATTL Advanced Materials Co.,Ltd.,Beijing 100094,China;Advanced Technology and Materials Co.,Ltd.,Beijing 100081,China)
机构地区:[1]安泰天龙钨钼科技有限公司,北京100094 [2]安泰科技股份有限公司,北京100081
出 处:《粉末冶金技术》2024年第3期290-296,共7页Powder Metallurgy Technology
摘 要:为了获得高性能钨合金,对93WNiFe钨合金进行旋锻变形加工,研究旋锻变形量对93WNiFe钨合金力学性能及组织的影响。结果表明,随着变形量的增加,93WNiFe钨合金组织中W晶粒由圆球状逐渐被拉长成长条状,室温抗拉强度随变形量的增加而增加,由982 MPa增加到1622 MPa,断后延伸率随变形量的增加快速降低,由35.5%下降到5.5%。当旋锻变形量小于15%时,随着变形量的增加,93WNiFe合金洛氏硬度快速增加,室温冲击韧性快速降低;当变形量大于15%后,合金洛氏硬度增加变缓,室温冲击韧性值降低变缓;当变形量为30%时,洛氏硬度最大为HRC 47.2,室温冲击韧性值最小为30.80 J·cm-2。未变形的烧结态93WNiFe合金断口形貌中存在少量W晶粒解理断裂、大量W–粘结相界面断裂、W–W界面断裂和粘结相韧窝断裂;随着锻造变形量的增加,断口形貌中W晶粒解理断裂数量逐渐增加,W–粘结相界面断裂、W–W界面断裂和粘结相韧窝断裂数量逐渐减少。The 93WNiFe alloys were deformed by rotary swaging process to obtain the high-performance tungsten alloys.The effect of rotary swaging deformation on the mechanical properties and microstructure of the 93WNiFe tungsten alloys were studied.The results show that,with the increase of deformation,the W grains in 93WNiFe tungsten alloys are elongated from spheroid to long strip,the tensile strength at room temperature increases from 982 MPa to 1622 MPa,and the elongation decreases from 35.5%to 5.5%.When the deformation of rotary swaging is less than 15%,the Rockwell hardness of the 93WNiFe alloys increases rapidly and the impact toughness decreases rapidly at room temperature with the increase of deformation.When the deformation is greater than 15%,the Rockwell hardness increases slowly,and the impact toughness decreases slowly at room temperature.When the deformation is 30%,the maximum Rockwell hardness is HRC 47.2,and the minimum impact toughness at room temperature is 30.80 J·cm-2.There are a small number of W grain cleavage fractures,a large number of W–bond phase interface fractures,W–W interface fractures,and binder phase dimple fractures in the sintered 93WNiFe alloys without deformation.With the increase of deformation,the number of W grain cleavage fractures increases gradually,and the number of W–bond phase interface fractures,W–W interface fractures,and binder phase dimple fractures decrease gradually.
分 类 号:TF123[冶金工程—粉末冶金] TG146.4[冶金工程—冶金物理化学]
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