ITO导电玻璃单颗磨粒切削机理仿真试验研究  

Simulation experimental on material removal mechanism of ITO conductive glass by single abrasive

作　　者：邱晓龙 孙兴伟[1,2,3] 刘寅 杨赫然 董祉序[1,2,3] 张维锋 QIU Xiaolong;SUN Xingwei;LIU Yin;YANG Heran;DONG Zhixu;ZHANG Weifeng(School of Mechanical Engineering,Shenyang University of Technology,Shenyang 110870,China;Liaoning Province Key Laboratory of Complex Surface NC Manufacturing Technology,Shenyang 110870,China;Liaoning Province University Complex Surface CNC Manufacturing Equipment Laboratory,Shenyang 110870,China)

机构地区：[1]沈阳工业大学机械工程学院,沈阳110870 [2]辽宁省复杂曲面数控制造技术重点实验室,沈阳110870 [3]辽宁省高校复杂曲面数控制造装备实验室,沈阳110870

出　　处：《金刚石与磨料磨具工程》2024年第3期354-362,共9页Diamond & Abrasives Engineering

基　　金：国家自然科学基金(52005346,52005347);辽宁省应用基础研究计划项目(2022JH2/101300214);辽宁省自然科学基金计划项目(2021-BS149);辽宁省教育厅科学研究经费项目(LQGD2020017)。

摘　　要：为研究氧化铟锡(indium tin oxide,ITO)导电玻璃材料的去除机理,采用单磨粒对材料进行切削仿真,建立了ITO导电玻璃的材料模型,根据加工表面形貌、应力和切削力情况分析了材料去除机理,之后研究了切削参数对切削力和残余应力的影响,并与钠钙玻璃进行对比分析。结果表明:在磨粒的切削过程中,材料的去除受ITO薄膜层、玻璃基底和内聚力接触行为的共同影响,会产生分层、通道开裂和层间断裂等失效形式;随着磨粒的进给,切削力在一定范围内波动,且呈现上升、稳定、降低的变化,同时磨粒的切削力与切削速度和切削深度呈正相关;薄膜上残余应力相比玻璃基底,数值更大且波动更剧烈;当切削深度接近ITO薄膜厚度时,薄膜的存在对磨粒切削行为的影响显著。To study the removal mechanism of ITO conductive glass materials,this paper uses a single abrasive particle to simulate the cutting process of the materials and establishes a material model for ITO glass.Based on the analysis of processed surface morphology,stress,and cutting force,the material removal mechanism of ITO glass is examined.Additionally,the influence of cutting parameters on cutting force and residual stress is studied and compared with sodalime glass.The results show that during the cutting process of abrasive particle,material removal is influenced by the ITO film layer,the glass substrate,and cohesive contact behavior,leading to failure forms such as delamination,channel cracking,and interlayer fracture.With the feed of the abrasive particle,the cutting force fluctuates within a certain range,exhibiting a pattern of growth,stability,and decrease.The cutting force of the abrasive particle is positively correlated with both cutting speed and cutting depth.Compared to the glass substrate,the residual stress on the ITO film is larger and fluctuates more dramatically.The presence of the ITO film significantly influences cutting behavior,especially when the cutting depth approaches the thickness of the ITO film.

关 键 词：ITO导电玻璃 材料去除机理 切削力 残余应力 

分 类 号：TG580.6[金属学及工艺—金属切削加工及机床]