氧化铝陶瓷封装外壳电镀爬金缺陷分析与解决  

Analysis and solution of gold creeping defects in electroplating of alumina ceramic package shell

作　　者：刘朋 张浩宇 向雪凤 张馨 何允鹏 杜支波 康建宏 Liu Peng;Zhang Haoyu;Xiang Xuefeng;Zhang Xin;He Yunpeng;Du Zhibo;Kang Jianhong(Chengdu Hongke Electronic Technology Co.,Ltd.,Chengdu 610100,China)

机构地区：[1]成都宏科电子科技有限公司,四川成都610100

出　　处：《电镀与精饰》2024年第7期44-48,共5页Plating & Finishing

摘　　要：针对焊接框架引线类陶瓷封装外壳电镀后爬金缺陷,采用扫描电子显微镜和能谱仪对电镀前的陶瓷外壳进行了分析。结果表明,在烧结和钎焊过程分别在陶瓷表面上引入了钨粉和焊料,在显微镜下无法筛选去除导致电镀后爬金。在增加了烧结工装的清洗和电镀前处理以及退火后,爬金缺陷得到有效解决。Aiming at the gold creeping defects after plating of ceramic package shells of soldered frame lead type,the ceramic shells before plating were analyzed by scanning electron microscope and energy spectrometer.The results showed that tungsten powder and solder were introduced onto the ceramic surface during the sintering and brazing processes,respectively,and could not be screened for removal under the microscope,resulting in gold creeping after electroplating.After increasing the cleaning of the sintering tool and the pretreatment of the plating and annealing,the gold creeping defects in the plating were effectively eliminated.

关 键 词：陶瓷封装外壳 电镀 爬金 钎焊 缺陷 

分 类 号：TQ153.1[化学工程—电化学工业]