环氧/聚酯复合树脂导电银浆的制备与研究  

Preparation and research of epoxy/polyester composite resin conductive silver paste

作　　者：赵科良 王大林 赵云龙 刘振国 孙欣烨 卢睿涵 ZHAO Keliang;WANG Dalin;ZHAO Yunlong;LIU Zhenguo;SUN Xinye;LU Ruihan(School of Chemistry and Chemical Engineering,Northwestern Polytechnical University,Xi'an 710129,China;Enterprise Technology Center,Xi'an Hongxing Electronic Paste Technology Co.,Ltd.,Xi'an 710199,China;Ningbo Research Institute,NorthwesternPolytechnical University,Ningbo 315103,China)

机构地区：[1]西北工业大学化学与化工学院,西安710129 [2]西安宏星电子浆料科技股份有限公司,企业技术中心,西安710199 [3]西北工业大学宁波研究院,浙江宁波315103

出　　处：《功能材料》2024年第6期6185-6190,共6页Journal of Functional Materials

基　　金：陕西省重点研发计划项目(2020GXLH-Z-028)、(2020GXLH-Z-030);西安市英才计划项目(2022)。

摘　　要：通过环氧树脂与聚酯树脂共混方法,研究了不同共混树脂银浆的流变、导电和力学特性。采用流变仪对树脂银浆的触变性和触变恢复率进行了探讨,进而讨论了流变性对印刷膜层的影响。原位电阻测试法对树脂银浆热固化电阻变化情况进行了监测,结果显示银浆中环氧树脂的含量对电阻有较大的影响。采用推力测试方法对树脂银浆在Al_(2)O_(3)基板的附着强度进行了评价,并评测了树脂银浆的热冲击性能。研究结果显示C-1银浆在环氧树脂和聚酯树脂含量比为1∶0.6时,粘度适中,10 s后触变恢复率58.03%,印刷表面平整;200℃固化30 min电阻为2Ω左右,附着强度约为10 N/mm^(2),经260℃热冲击附着强度无明显劣化,综合性能较优,适用于电子元器件的工艺要求。In this paper,the rheological,electrical and mechanical properties of silver paste with different blends of epoxy resin and polyester resin were studied.The thixotropy and thixotropy recovery rate of resin silver paste were studied by rheometer,and the effect of rheology on printing film was discussed.In situ curving resistance test method was used to monitor the change of thermal curing resistance of silver resin paste.The results showed that the content of epoxy resin in silver paste had great influence on the resistance.The adhesion strength of resin silver paste on Al_(2)O_(3) substrate was evaluated by the thrust test method,and the thermal impact performance of resin silver paste was evaluated.The results showed that when the ratio of epoxy resin to polyester resin was 1:0.6,the viscosity of C-1 silver paste was moderate,the thixotropic recovery rate was 58.03%after 10 s,and the printing surface was flat.After curing at 200℃for 30 min,the resistance is about 2Ω,the adhesion strength is about 10 N/mm^(2),and the adhesion strength is not significantly deteriorated after thermal shock at 260℃.The comprehensive performance is better,and it is suitable for the process requirements of electronic components.

关 键 词：环氧树脂 聚酯树脂 热固化 树脂银浆 流变性 附着强度 

分 类 号：TM8[电气工程—高电压与绝缘技术] TM91TM98