光学元器件磁辅助抛光特性探究  

Exploration of Magnetic Assisted Polishing Characteristics of Optical Components

作　　者：李壮 Zhuang Li(School of Mechanical Engineering,Shanghai University of Technology,Shanghai)

机构地区：[1]上海理工大学机械工程学院,上海

出　　处：《建模与仿真》2024年第3期2203-2213,共11页Modeling and Simulation

摘　　要：为探究磁性复合流体抛光中抛光间隙对熔石英玻璃去除特性的影响,对抛斑截面轮廓进行特征分析,通过对抛光斑轮廓进行三维重构,并对磁场空间分布进行了理论分析和实际测试,阐明抛光去除机理,确定了抛光斑表面粗糙度和、材料去除率和紫外光透过率随抛光间隙的影响规律,并建立了材料去除深度与磁通密度的关系曲线。实验结果表明:抛光斑的轴向方向和纵向方向截面轮廓分别呈现出“W”和“V”形;且同一抛光时间下,减小抛光间隙,MCF抛光能获得的更大的抛光斑长度、宽度及抛光深度;材料去除率与抛光间隙及空间磁场分布密切相关,抛光深度去除率最高可达1230 nm/min。To investigate the effect of polishing gaps on the removal characteristics of fused quartz glass in magnetic composite fluid polishing,a characteristic analysis was conducted on the cross-section profile of the polishing spot.By reconstructing the polishing spot profile in three dimensions and conducting theoretical analysis and practical testing on the spatial distribution of the magnetic field,the polishing removal mechanism was elucidated.The influence of polishing gap on the surface roughness of the polishing spot,material removal rate,and ultraviolet light transmittance was determined,and the relationship curve between material removal depth and magnetic flux density was established.The experimental results show that the axial and longitudinal cross-sectional profiles of the polishing spot exhibit“W”and“V”shapes,respectively;Under the same polishing time,reducing the polishing gap can result in larger polishing spot length,width,and depth that MCF polishing can achieve;The material removal rate is closely related to the polishing gap and spatial magnetic field distribution,and the maximum removal rate of polishing depth can reach 1230 nm/min.

关 键 词：磁性复合流体抛光 材料去除率 粗糙度 磁场分布 

分 类 号：TG1[金属学及工艺—金属学]