液晶玻璃基板智能切割生产线的切割工艺研究  

Research on Cutting Process of Intelligent Cutting Production Line for Liquid Crystal Glass Substrate

作　　者：于百灵 段跃伟 郑海红 Yu Bailing;Duan Yuewei;Zheng Haihong(CEC Fenghua Information Equipment Co.,Ltd.,Taiyuan Shanxi 030024,China)

机构地区：[1]中电科风华信息装备股份有限公司,山西太原030024

出　　处：《机械管理开发》2024年第6期16-18,21,共4页Mechanical Management and Development

摘　　要：阐述了在实际生产中切割压力、刀轮下压量、刀轮种类对液晶玻璃基板切割过程中产生的垂直裂纹和横向裂纹的影响,通过提高机构的稳定性以及关键零部件的加工精度改善不良因素对切割品质的影响。The effects of cutting pressure,cutter wheel downward pressure,and cutter wheel type on vertical and transverse cracks generated during the ctting process of LCD glass substrate in actual production are described,and the effects of adverse factors on cutting quality are improved by improving the stability of the mechanism and the machining accuracy of key components.

关 键 词：液晶玻璃 切割压力 切割深度 刀轮种类 

分 类 号：TN873.93[电子电信—信息与通信工程]