粉末冶金技术在溅射靶材制备中的研究现状  

Research Status of Powder Metallurgy Technology in Preparation of Sputtering Target Materials

作　　者：姚甜 王新锋 刘李旭 向长淑 YAO Tian;WANG Xinfeng;LIU Lixu;XIANG Changshu(Xi'an Sailong Metal Materials Co.,Ltd.,Xi'an 710000,China;State Key Laboratory of Porous Metal Materials,Xi'an 710000,China)

机构地区：[1]西安赛隆金属材料有限责任公司,陕西西安710000 [2]金属多孔材料国家重点实验室,陕西西安710000

出　　处：《热加工工艺》2024年第7期7-10,36,共5页Hot Working Technology

摘　　要：磁控溅射靶材由于沉积速率快、镀膜均匀等优点,已成为各类薄膜材料的首选制备方法。同时薄膜材料的广泛应用使得靶材的需求量逐年增多。近年来,粉末冶金技术在溅射靶材制备中得到了广泛应用。本文对靶材制备中使用的粉末冶金技术进行总结和工艺分析,并阐述热压烧结、热等静压烧结、放电等离子烧结的研究现状,最后探讨靶材制备研究中存在的技术问题和发展趋势。Magnetron sputtering target has become the preferred method for preparing all kinds of thin films due to its advantages of fast deposition rate and uniform coating.Broad application of thin film materials makes the target material demand increase year by year.In recent years,powder metallurgy technology has been widely used in target material preparation.The powder metallurgy method used in the target preparation was summarized and analyzed,and the research status of hot pressing sintering,hot isostatic pressing sintering and spark plasma sintering were described.Finally,the technical problems in the research of target preparation and the development trend were discussed.

关 键 词：粉末冶金 靶材 热压烧结 热等静压烧结 放电等离子烧结 

分 类 号：TG146.4[一般工业技术—材料科学与工程]