微系统封装陶瓷外壳结构可靠性设计研究  

Research on Structural Reliability Design of Ceramic Package for Microsystem Packaging

作　　者：杨振涛 余希猛 于斐 段强 陈江涛 淦作腾[1] 张志忠[1] YANG Zhentao;YU Ximeng;YU Fei;DUAN Qiang;CHEN Jiangtao;GAN Zuoteng;ZHANG Zhizhong(No.13 Research Institute of China Electronics Technology Group Corporation,Shijiazhuang 050051,China)

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《电子质量》2024年第6期68-72,共5页Electronics Quality

摘　　要：由于微系统的集成芯片多、密度大且可靠性要求高,因此大部分微系统采用封装密度高、电热性能好且气密性好的陶瓷封装,封装管壳和基板为一体化设计,大大节省了布局空间。陶瓷外壳作为微系统的载体,其结构可靠性对微系统的性能起至关重要的作用,因此基于高密度多层共烧陶瓷技术体系,采用有限元分析软件,对微系统外壳的结构可靠性进行了系统仿真研究,形成了适用于微系统封装的大尺寸、高可靠外壳的结构设计规则。采用该规则设计的微系统具有高可靠、高密度、高性能、低功耗和设计周期短等优势。Due to the large number of integrated chips,high density,and high reliability requirements of microsystems,most microsystems adopt ceramic package with high package density,good thermal performance,and good airtightness,as well as the integrated design of packaging shell and substrate,which greatly saves layout space.As the carrier of microsystems,the structural reliability of ceramic package plays a crucial role in the performance of microsystems.Therefore,based on the high-density multi-layer co-fired ceramic technology system,finite element analysis software is used to conduct a systematic simulation study on the structural reliability of microsystem shell,and structural design rules suitable for large-sized and highly reliable shell of microsystem package are formed.Microsystems designed using this design rules have advantages of high reliability,high density,high performance,low power consumption and short design cycles.

关 键 词：微系统 多层共烧陶瓷 热膨胀系数 结构可靠性 有限元分析 仿真 

分 类 号：TP114.35[自动化与计算机技术—控制理论与控制工程] TP391.99[自动化与计算机技术—控制科学与工程]