导热绝缘高密度聚乙烯复合材料的制备与性能  

Preparation and Properties of Thermally Conductive Electrically Insulative High Density Polyethylene-Based Composites

作　　者：王贯春[1] 李瑶[2] 李吉祥 周生态 梁梅[2] 邹华维[2] 邱邵宇 GuanchunWang;Yao Li;Jixiang Li;Shengtai Zhou;Mei Liang;Huawei Zou;Shaoyu Qiu(Science and Technology on Reactor Fuel and Materials Laboratory,Nuclear Power Institute of China,Chengdu 610041,China;State Key Laboratory of Polymer Materials Engineering,Polymer Research Institute of Sichuan University,Chengdu 610065,China)

机构地区：[1]中国核动力研究设计院反应堆燃料及材料重点实验室,四川成都610041 [2]四川大学高分子研究所高分子材料工程国家重点实验室,四川成都610065

出　　处：《高分子材料科学与工程》2024年第5期39-46,共8页Polymer Materials Science & Engineering

摘　　要：文中采用片层状绝缘导热六方氮化硼(h-BN)和高导热导电铜粉(Cu)复配填充来提升高密度聚乙烯(HDPE)的导热性能。控制导热填料总体积分数为30%,通过改变h-BN和Cu在HDPE中的复配比例,实现复合材料中导热网络通路的构建。扫描电镜结果表明,h-BN进入Cu粉无法占据的HDPE基体,起到桥梁作用。h-BN通过连接其周围的Cu粒子,促进了HDPE内部导热网络的形成与构筑。Hot Disk测试结果表明,随着h-BN/Cu比值增加,HDPE复合材料导热系数增大。当V(h-BN):V(Cu)≤1时,大片径h-BN_(30)/Cu体系的热导率高于小片径h-BN_(05)/Cu改性体系;与之相反,当V(h-BN):V(Cu)>1时,相对于大片径h-BN_(30),小片径h-BN_(05)对复合体系热导率的贡献更明显。通过调控h-BN与Cu的含量,实现了在抑制导电网络形成的前提下大幅改善复合材料的导热性能。其研究工作为导热绝缘复合材料的设计制备提供参考。A combination of layered insulating hexagonal boron nitride(h-BN)and highly thermally conductive copper powder(Cu)was employed as fillers to enhance the thermal conductivity of high-density polyethylene(HDPE).The overall volume fraction of thermal conductive fillers was controlled at 30%,and the construction of thermal conduction pathways in the composite material was achieved by varying the blending ratio of h-BN and Cu powder in HDPE.Scanning electron microscopy results demonstrate that h-BN acts as bridge by entering the HDPE matrix unoccupied by Cu powder.h-BN facilitates the formation and construction of internal thermal conduction networks in HDPE by connecting surrounding Cu powder particles.Thermal conductivity results from HotDisk test indicate that as the h-BN/Cu volume ratio increases,the thermal conductivity coefficient of HDPE composite materials also increases.When V(h-BN):V(Cu)≤1,the thermal conductivity of the large-sized h-BN_(30)/Cu system is higher than that of the small-sized h-BN_(05)/Cu modified system;conversely,when V(h-BN):V(Cu)>1,the contribution of small-sized h-BN_(05) to the thermal conductivity of the composite system is more pronounced compared to the large-sized h-BN_(30).By controlling the content of h-BN and Cu,an increase in the thermal conductivity coefficient of composite materials is achieved while suppressing the formation of conductive networks,offering a new solution for the design of thermally conductive insulation materials.

关 键 词：高密度聚乙烯 氮化硼 铜粒子 导热网络 协同效应 

分 类 号：TB332[一般工业技术—材料科学与工程]