一种活化添加剂对化学镀镍层结合力的影响  

Effect of an activation additive on the adhesion of electroless nickel plating

作　　者：陈光辉 赖海祥 王倩玉 黄子峰 CHEN Guanghui;LAI Haixiang;WANG Qianyu;HUANG Zifeng(Guangdong Toneset Technology Co.,Ltd.,Guangzhou 511495,Guangdong,China)

机构地区：[1]广东东硕科技有限公司,广东广州511495

出　　处：《印制电路信息》2024年第7期20-25,共6页Printed Circuit Information

摘　　要：在印制电路板(PCB)化学镀镍/金(ENIG)工艺中,活化对焊盘的渗镀、漏镀影响十分重要,然而活化对化学镀镍与基底铜结合力的影响易被忽视。通过对一种活化添加剂进行研究,发现其在活化过程中易吸附在基底表面,夹杂在基底铜与化学镀镍层之间,并且加速了基底铜表面小尺寸空洞的形成,最终导致镀层的结合力降低。In the electroless nickel/immersion gold(ENIG)process of printed circuit boards(PCBs),the activation has a significant impact on the extraneous plating and skip plating,but the influence of activation on the adhesion between electroless nickel plating and substrate copper is easily ignored.This paper studies an activation additive and finds that it is easily adsorbed on the substrate surface during the activation process,mixed between the substrate copper and the electroless nickel plating layer,and accelerates the formation of small-sized voids on the copper surface,ultimately leading to a decrease in the adhesion of the coating.

关 键 词：化学镀镍/金 活化 添加剂 镀层结合力 

分 类 号：TQ153.2[化学工程—电化学工业]