半挠性刚挠结合板的一种制作方法  

The production method of semi-flexible rigid⁃flex printed circuit board

作　　者：黎育民 LI Yumin(Ganzhou Chaoyue Technology Co.,Ltd.,Ganzhou 341000,Jiangxi,China)

机构地区：[1]赣州市超跃科技股份有限公司,江西赣州341000

出　　处：《印制电路信息》2024年第7期36-39,共4页Printed Circuit Information

摘　　要：提出了一种新型半挠性刚挠结合板的制作方法。首先,一次压合半挠性基板与半固化片(PP),在半挠性区域对应位置的另一张PP上进行开窗处理;然后,在刚性板上的对应位置进行铣槽处理;最后,二次压合所有板材,并用铣刀去除半挠性区域上方对应位置的材料,露出半挠性区域。该方法有效填补了传统制作工艺在制造半挠性硬板结合产品时的缺陷和不足,进而实现产品性能与产品品质的双重提升。A new manufacturing method for semi⁃flexible rigid⁃flex composite boards has been proposed,with the following production ideas.Firstly,the semi⁃flexible substrate and prepreg are pressed,and window opening treatment is performed on another prepreg at the corresponding position in the semi⁃flexible area.Next,groove milling treatment is performed at the corresponding position on the rigid plate.Finally,all the boards are pressed again and a milling cutter is used to remove the corresponding material above the semi⁃flexible area,exposing the semi⁃flexible area.This method effectively fills the gaps and shortcomings of traditional manufacturing techniques in manufacturing semi⁃flexible hard board composite products,thereby achieving a dual⁃improvement in product performance and quality.

关 键 词：印制电路板 半挠性 开窗 铣槽 

分 类 号：TN41[电子电信—微电子学与固体电子学]