挠性印制电路板内置熔断体的多物理场耦合仿真  

Multiphysics coupling simulation of built-in fuse in flexible printed circuit board

作　　者：黄茂梁 潘丽 齐伟 李多生[1] 屈润宁 张江 奚琳 HUANG Maoliang;PAN Li;QI Wei;LI Duosheng;QU Running;ZHANG Jiang;XI Lin(School of Materials Science and Engineering,Nanchang Hangkong University,Nanchang 330063,Jiangxi,China;AKM Electronics Technology(Suzhou)Co.,Ltd.,Suzhou 215129,Jiangsu,China)

机构地区：[1]南昌航空大学材料科学与工程学院,江西南昌330063 [2]安捷利电子科技(苏州)有限公司,江苏苏州215129

出　　处：《印制电路信息》2024年第7期40-45,共6页Printed Circuit Information

基　　金：国家自然科学基金资助项目(51562027);苏州市重大科技成果转化计划项目(SZC202318);苏州市重点产业技术创新(关键核心技术研发)项目(SGC2021017)。

摘　　要：基于一种应用于新能源汽车动力电池模组集成母排上的挠性印制电路板(FPCB)内置熔断体结构,建立电-热-结构多物理场耦合仿真模型,对熔断体进行多场耦合仿真分析。仿真结果表明:室温环境下,电流密度最大值出现在熔断体弯折处;最高温度出现在熔断体中间熔体部分;环境温度越高或对流传热系数越小,熔断体升温速率越快。基于仿真模型发现,增大电流后熔断时间缩减。仿真结果可为FPCB内置熔断体结构设计、生产及测试提供重要参考。In this paper,an electrical-thermal-structural multiphysics coupling model of built-in fuse is simulated for flexible printed circuit board(FPCB)built-in fuse applied to new energy vehicle power batteries.Simulation results show that at room temperature,the maximum current density appears at the bend of built-in fuse.It indicates that the bend of built-in fuse is the most dangerous area.The highest temperature of built-in fuse appears in the middle of it.The higher the ambient temperature or the smaller the convective heat transfer coefficient,the faster the heating rate of built-in fuse.Based on the simulation model,it is found that when the current increases,the fusing time decreases.The simulation results provide important guidance for the structural design,production and test of built-in fuse in FPCB.

关 键 词：内置熔断体 多物理场耦合 仿真分析 挠性印制电路板 

分 类 号：TN41[电子电信—微电子学与固体电子学]