空间遥感相机轻型探测器组件粘接方法研究  

Research on bonding method of light detector assembly of space remote sensing camera

作　　者：李金辉 朱英博 丛杉珊 张雷 LI Jinhui;ZHU Yingbo;CONG Shanshan;ZHANG Lei(Optical-Mechanical Structure Laboratory,Chang Guang Satellite Technology Co.,Ltd.,Changchun 130102,China)

机构地区：[1]长光卫星技术股份有限公司光机结构研究室,吉林长春130102

出　　处：《红外与激光工程》2024年第6期115-124,共10页Infrared and Laser Engineering

摘　　要：对于小尺寸的空间遥感相机轻型探测器,为避免机械固定引入的装配应力对探测器感光面面形造成的影响,设计了一种轻型探测器粘接方法,计算胶层厚度减小粘接应力,保证粘接后的结构强度。首先,根据探测器组件工作环境选用合适的粘接剂为GHJ-01光学环氧胶和GD414硅橡胶,然后,通过无热粘接方程确定粘接胶层厚度为0.2mm,并进行粘接面积计算,结合胶层参数制定了六种粘接方案;通过对探测器组件进行有限元仿真分析,计算了关键单元的变形情况,得到在温升工况下,探测器感光面面形变化低于0.0012mm的三种粘接方案;在经过随机振动和高低温热循环试验后,使用光学拼接仪和三坐标测量仪检测探测器拼接精度变化,对比试验结果得到最优粘接方案。最终检测结果表明,使用GD414硅橡胶粘接探测器底面和侧面,GHJ-01光学环氧胶顶部点胶的方案能够保证探测器组件在温升和力学振动条件下,保持面形精度优于0.0007mm,直线精度优于0.001mm。对于小尺寸轻型探测器,最终优选的粘接方案能够满足粘接结构强度,符合探测器组件拼接精度要求。Objective The core component of space remote sensing camera imaging is the detector,which is generally an image sensor and is fixed to the mechanical parts.The traditional fixed method of the detector is to use the pressing plate and other parts for mechanical fixing,which is easy to cause assembly stress,which will affect the shape of the detector's sensitive surface and affect the imaging quality.However,for light detectors of small size,a bonding method can be designed to control the thickness of the adhesive layer to reduce the bonding force and ensure the structural strength after bonding.Methods The accuracy change of the detector by different bonding methods was analyzed by simulation combined with environmental test.Firstly,according to the working environment of the detector assembly,the appropriate adhesive is selected,the specific model is GHJ-01 optical epoxy adhesive and GD414 silicone rubber.Due to the different coefficient of thermal expansion of the bonded objects,the stress will be generated when the temperature changes.In order to reduce the stress,the thickness of the adhesive layer is determined to be 0.2 mm through the non-thermal bonding equation combined with the actual engineering calculation,and the bonding area is calculated to ensure the bonding strength.Six bonding schemes were proposed according to the parameters of the adhesive layer.The finite element simulation analysis was carried out on the detector components in the six schemes.The deformation of the key elements of the detector photosensitive surface was calculated and output,and several bonding schemes with small change of the detector photosensitive surface shape were obtained under the condition of temperature rise.After random vibration and high and low temperature cycle tests,optical splicing instrument and coordinate measuring instrument were used to detect the changes in detector splicing accuracy(including detector component straightness and detector flatness),and the optimal bonding scheme was obtained by comparing the

关 键 词：探测器 粘接应力 硅橡胶 光学环氧胶 拼接精度 

分 类 号：TH703[机械工程—仪器科学与技术]