红外探测器锗窗口无助焊剂回流焊接工艺研究  

Study on reflow soldering process without flux for Ge window of infrared detectors

作　　者：赵璨 回品 李硕 ZHAO Can;HUI Pin;LI Shuo(North China Research Institute of Electro-Optics,Beijing 100015,China)

机构地区：[1]华北光电技术研究所,北京100015

出　　处：《激光与红外》2024年第6期920-923,共4页Laser & Infrared

摘　　要：对红外探测器锗窗口无助焊剂回流焊接工艺进行了研究,在还原性气氛下使用铟焊料片对不同镀层体系的锗窗口和可伐合金进行了焊接试验。通过对不同镀层体系下焊接的窗口部件的焊缝形貌、真空漏率分析、X射线无损检测分析以及可靠性试验分析,表明通过对锗窗口和可伐合金焊接面镀金处理,在还原性气氛下回流焊接可以制备出满足密封要求和环境适应性要求的窗口部件。In this paper,the reflow soldering process without flux for Ge window of infrared detectors is investigated,and soldering tests on Ge windows and Kovar alloys with different plating systems are conducted using In solder pieces in a reducing atmosphere.Through the analysis of weldappearance,vacuum leak rate,X ray NDT,and reliability test of window components soldered under different plating systems,it is shown that gold plating on the soldering surface of Ge windows and Kovar alloys can be used to prepare window components that meet the requirements of sealing and environmental adaptability under reflow soldering in a reducing atmosphere.

关 键 词：红外探测器 锗窗口 回流焊接 还原性气氛 

分 类 号：TN214[电子电信—物理电子学] TN205