Exploring Trade-offs in Thermal Interface Materials:The Impact of Polymer-Filler Interfaces on Thermal Conductivity and Thixotropy  

作　　者：Bin Zhang Zheng-Li Dou Yong-Zheng Zhang Qiang Fu Kai Wu 

机构地区：[1]College of Polymer Science and Engineering,State Key Laboratory of Polymer Materials Engineering,Sichuan University,Chengdu,610065,China

出　　处：《Chinese Journal of Polymer Science》2024年第7期916-925,I0006,共11页高分子科学（英文版）

基　　金：financially supported by the National Natural Science Foundation of China(Nos.52373042 and 52103091);the National Key Research and Development Project of China(No.2022YFB3806900);the International Visiting Program for Excellent Young Scholars of SCU。

摘　　要：Effective thermal transport across solid-solid interfaces which is essential in thermal interface materials(TIMs),necessitates both optimal thixotropy and high thermal conductivity.The role of filler surface modification,a fundamental aspect of TIM fabrication,in the influence of these properties is not fully understood.This study employs the use of a silane coupling agent(SCA)to modify alumina,integrating experimental approaches with molecular dynamics simulations,to elucidate the interface effects on thixotropy and thermal conductivity in polydimethylsiloxane(PDMS)-based TIMs.Our findings reveal that the variations of SCAs modify both interface binding energy and transition layer thickness.The interface binding energy restricts macromolecular segmental relaxation near the interface,hindering desirable thixotropy and bond line thickness.On the contrary,the thickness of the transition layer at the interface positively influences thermal conductivity,facilitating the transport of phonons between the polymer and filler.Consequently,selecting an optimal SCA allows a balance between traditionally conflicting goals of high thermal conductivity and minimal bond line thickness,achieving an impressively low interface thermal resistance of just 2.45-4.29 K·mm^(2)·W^(-1)at275.8 kPa.

关 键 词：Thermal interface material Surface modification Thermal conductivity THIXOTROPY Interface thermal resistance 

分 类 号：TB34[一般工业技术—材料科学与工程]