钨铜复合材料制备工艺研究  

Study on Preparation Process of W-Cu Composite Materials

作　　者：李乃拥 王芦燕 刘山宇 LI Naiyong;WANG Luyan;LIU Shanyu(BGRIMM Advanced Materials Science&Technology Co.,Ltd.,Beijing 102206,China;BGRIMM Technology Group,Beijing 100160,China)

机构地区：[1]北矿新材科技有限公司,北京102206 [2]矿冶科技集团有限公司,北京100160

出　　处：《热喷涂技术》2024年第2期88-98,共11页Thermal Spray Technology

摘　　要：分别采用直接机械合金化法及氧化物共还原法制备了W-10Cu和W-20Cu复合材料,研究了钨粉粒度、烧结温度和保温时间对钨铜合金显微组织、致密度和电导率的影响。结果表明:随着W粉粒度的增大,直接机械合金化法制备的钨铜合金组织中W晶粒逐渐增大,致密度逐渐降低,电导率逐渐增大。在相同烧结条件下,氧化物共还原法较直接机械合金化法制备的钨铜合金组织中W晶粒尺寸细小,分布均匀,致密度和电导率更高。随着烧结温度的升高,钨铜合金组织中W晶粒尺寸逐渐增大,致密度和电导率逐渐增加。当烧结温度由1500℃增加至1600℃时,氧化物共还原法制备的W-10Cu合金中W平均晶粒尺寸由2.1μm增加至3.6μm,致密度由98.2%增加至98.5%,电导率由39.3%IACS增加至39.8%IACS;W-20Cu合金中W平均晶粒尺寸由2.3μm增加至3.5μm,致密度由98.4%增加至99.2%,电导率由40.8%IACS增加至41.6%IACS。此外,钨铜合金组织中W晶粒尺寸随着保温时间的增加而逐渐增大。W-10Cu and W-20Cu composite materials were prepared by direct mechanical alloying and oxide co-reduction methods,respectively.The effects of W powder particle size,sintering temperature,and holding time on the microstructure,density,and conductivity of W-Cu alloy were studied.The results show that with the increase of W powder particle size,the W grain size in the W-Cu alloy prepared by direct mechanical alloying method increases gradually,the density drops gradually,and the conductivity increases gradually.Under the same sintering conditions,compared to the direct mechanical alloying method,the W-Cu alloys prepared by the oxide co-reduction method has smaller W grain size,uniform distribution,higher density and conductivity.With the increases of sintering temperature,the W grain size in the W-Cu alloy increases gradually,the relative density and conductivity increase gradually.When the sintering temperature increases from 1500℃to 1600℃,the average grain size of W in W-10Cu alloy prepared by oxide co-reduction method increases from 2.1μm to 3.6μm,the density increases from 98.2%to 98.5%,and the conductivity increases from 39.3%IACS to 39.8%IACS.The average grain size of W in W-20Cu alloy increases from 2.3μm to 3.5μm,the density increases from 98.4%to 99.2%,and the conductivity increases from 40.8%IACS to 41.6%IACS.In addition,the W grain size in the microstructure of W-Cu alloy increases gradually with the increase of holding time.

关 键 词：钨铜复合材料 机械合金化 氧化物共还原 显微组织 致密度 电导率 

分 类 号：TG146.4[一般工业技术—材料科学与工程]