基于统计过程控制的硅转接板良率优化系统设计  

Silicon Interposer Yield Optimization System Based on Statistical Process Control

作　　者：付予 杨银堂[1] 刘文宝 刘莹莹 单光宝 FU Yu;YANG Yintang;LIU Wenbao;LIU Yingying;SHAN Guangbao(School of Microelectronics,Xidian University,Xi’an 710071,China;China Astronautics Standards Institute,Beijing 100071,China)

机构地区：[1]西安电子科技大学微电子学院,陕西西安710071 [2]中国航天标准化研究所,北京100071

出　　处：《系统仿真技术》2024年第1期21-24,共4页System Simulation Technology

基　　金：国家重点研发计划项目(2022YFB440130001)。

摘　　要：针对2.5D封装用硅通孔(through silicon via,TSV)硅转接基板批量化生产过程中缺乏可靠性评价与优化技术的问题,提出基于统计过程控制(statistical process control,SPC)的评估控制系统,实现在线工艺状态监控及评价,设计硅转接板测试用工艺控制检测(process control monitor,PCM)结构,阐述自动光学检测(automated optical inspection,AOI)中常见的缺陷对系统可靠性的影响。提出的SPC系统对硅转接板批量化生产良率提升具有重要意义。For the lack of reliability evaluation and optimization technology in the mass production process of through silicon via(TSV)silicon interposer for 2.5D packaging,an evaluation and control system based on statistical process control(SPC)is proposed.Online process status monitoring and evaluation are achieved.The process control monitor(PCM)structure for silicon interposer testing is designed.The influence of common defects in automated optical inspection(AOI)on system reliability is elaborated.The SPC system proposed is of great significance to improve the yield of silicon interposers in batch production.

关 键 词：硅转接板 统计过程控制 可靠性评价 工艺控制检测 自动光学检测 

分 类 号：TP311[自动化与计算机技术—计算机软件与理论]