高端集成电路半导体厂房项目接地系统分析  

Analysis of Grounding System of High-end Integrated Circuit Semiconductor Plant Project

作　　者：许京哲 Xu Jingzhe(China Electronics System Engineering No.2 Construction Co.,Ltd,Wuxi 214111,China)

机构地区：[1]中国电子系统工程第二建设有限公司,无锡214111

出　　处：《智能建筑电气技术》2024年第3期85-92,共8页Electrical Technology of Intelligent Buildings

摘　　要：根据若干高端先进制程集成电路厂房工程接地系统的设计及使用现状,基于接地系统设计依据及理论基础,全面进行多方案综合比较。计算分析不同接地方式下的接地电阻,梳理各类接地系统之间的关联性及相互影响,分析接地故障或失败对生产的负面影响,提出接地系统技术重点及其解决措施。最后总结出适用于高端集成电路半导体厂房的接地系统设计方案,方便后续其他类似项目借鉴。According to the design and use status of several high-end advanced process integrated circuit plant engineering grounding system,based on the grounding system design basis and theoretical basis,a comprehensive multi-scheme comparison is carried out.The grounding resistance under different grounding methods is calculated and analyzed,the correlation and mutual influence between various types of grounding systems are sorted out,the negative impact of grounding fault or failure on production is analyzed,and the technical focus and solutions of grounding system are put forward.Finally,the grounding system design scheme suitable for high-end integrated circuit semiconductor plant is summarized,which is convenient for the reference of other similar projects in the future.

关 键 词：集成电路 联合接地 共用接地 独立接地 

分 类 号：TU856[建筑科学]