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作 者:LUIGI RANNO JIA Xu BRIAN SIA COSMIN POPESCU DREW WENINGER SAMUEL SERNA SHAOLIANG YU LIONEL C.KIMERLING ANURADHA AGARWAL TIAN GU JUEJUN HU
机构地区:[1]Department of Materials Science&Engineering,Massachusetts Institute of Technology,Cambridge,Massachusetts 02139,USA [2]Centre for Micro-&Nano-Electronics(CMNE),Nanyang Technological University,Singapore 639798,Singapore [3]Department of Physics,Photonics and Optical Engineering,Bridgewater State University,Bridgewater,Massachusetts 02324,USA [4]Zhejiang Laboratory,Hangzhou 311100,China [5]Materials Research Laboratory,Massachusetts Institute of Technology,Cambridge,Massachusetts 02139,USA
出 处:《Photonics Research》2024年第5期1055-1066,共12页光子学研究(英文版)
基 金:National Science Foundation(ITE-2236093,NSF ITE Convergence Accelerator);Ministry of Education-Singapore(International Postdoctoral Fellowship)。
摘 要:As silicon photonics transitions from research to commercial deployment,packaging solutions that efficiently couple light into highly compact and functional sub-micrometer silicon waveguides are imperative but remain challenging.The 220 nm silicon-on-insulator(SOI)platform,poised to enable large-scale integration,is the most widely adopted by foundries,resulting in established fabrication processes and extensive photonic component libraries.The development of a highly efficient,scalable,and broadband coupling scheme for this platform is therefore of paramount importance.Leveraging two-photon polymerization(TPP)and a deterministic free-form micro-optics design methodology based on the Fermat’s principle,this work demonstrates an ultraefficient and broadband 3-D coupler interface between standard SMF-28 single-mode fibers and silicon waveguides on the 220 nm SOI platform.The coupler achieves a low coupling loss of 0.8 dB for the fundamental TE mode,along with 1 dB bandwidth exceeding 180 nm.The broadband operation enables diverse bandwidthdriven applications ranging from communications to spectroscopy.Furthermore,the 3-D free-form coupler also enables large tolerance to fiber misalignments and manufacturing variability,thereby relaxing packaging requirements toward cost reduction capitalizing on standard electronic packaging process flows.
分 类 号:TN622[电子电信—电路与系统]
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