基于调制声场的腔体内壁黏附物清洗方法  

Shaping acoustic fields-based for cleaning method particulate contaminants in the inner wall of microcavity

作　　者：田振 蔡飞燕[2] 王金萍 李剑平 李永川[2] 邓科[1] 郑海荣[2] TIAN Zhen;CAI Feiyan;WANG Jinping;LI Jianping;LI Yongchuan;DENG Ke;ZHENG Hairong(College of Physics and Mechanical and Electrical Engineering,Jishou University,Jishou 416000,China;Paul C.Lauterbur Research Center for Biomedical Imaging,Shenzhen Institutes of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055,China;Optoelectronics Research Center for Engineering and Technology,Shenzhen Institutes of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055,China)

机构地区：[1]吉首大学物理与机电工程学院,吉首416000 [2]中国科学院深圳先进技术研究院劳特伯生物医学成像中心,深圳518055 [3]中国科学院深圳先进技术研究院光电工程技术中心,深圳518055

出　　处：《应用声学》2024年第4期750-755,共6页Journal of Applied Acoustics

基　　金：国家自然科学基金项目(11974372,11964011,12004409);深圳市基础研究项目(JCYJ20200109105823170,JCYJ20200109110006136)。

摘　　要：传统超声清洗技术已经广泛应用于器件外表面的清洗,但对于微器件内部,如:狭缝、微腔体等,目前该技术仍难以胜任。其主要原因是自由微泡难以在器件内部指定位置稳定持续爆破。该文提出利用调制声场调控微腔体内声场极值的位置,使得微泡在声辐射力的作用下能够移动并停驻在腔体内壁附近位置,再采用瞬时高强度低频声场爆破微泡,其产生的微射流等实现腔体内壁黏附物分离并清洗的目的。该技术可以为医疗微管、光学仪器以及半导体芯片等精密器件的腔体内部清洗提供物理模型和技术基础。Traditional ultrasonic cleaning technology has been widely used for cleaning the external surfaces of devices.However,this technology is still in challenges for the inner surface of microdevices,such as narrow gaps and microcavities.The main reason is that free microbubbles are difficult to trap and collapse at targeted positions of the inner cavity.This article proposes using shaping sound fields to manipulate the maximum/minimum position of the gradient field in the inner cavity,then the induced acoustic radiation force can move and trap microbubbles near the inner wall of the cavity,after exciting the low-frequency and highintensity ultrasonic field,these bubbles are collapsed near the inner surface of the cavity,thus,the inner surface of the cavity can be cleaned efficiently.This technology paves the way for cleaning precision devices,such as medical microtubes,optical instruments,and semiconductor chips.

关 键 词：超声清洗 调制声场 腔体清洗技术 颗粒污染物分离 

分 类 号：O429[理学—声学]