高频铜箔的专利技术分析  

Patent Analysis of High-frequency Copper Foil

作　　者：姚日英[1] 刘红艳 陈刚[1] YAO Riying;LIU Hongyan;CHEN Gang(Patent Examination Cooperation(Jiangsu)Center of the Patent Office,CNIPA,Suzhou 215011,China)

机构地区：[1]国家知识产权局专利局专利审查协作江苏中心,江苏苏州215011

出　　处：《河南科技》2024年第12期136-139,共4页Henan Science and Technology

摘　　要：【目的】重点分析高频铜箔的技术,对其申请状况、技术发展脉络和研发路线进行剖析,以掌握高频铜箔专利技术的发展情况。【方法】通过专利分析,重点研究高频铜箔专利申请的变化趋势、申请人区域分布、申请人排名、专利申请的技术构成等。【结果】日本、中国、美国、韩国是高频覆铜板铜箔专利申请的主要来源国/地区。【结论】在高频铜箔领域,日本专利储备丰富,占据了绝对优势,我国目前和未来潜在的专利障碍较大。中国龙头企业则是后来者居上,近年来得益于5G技术的发展和庞大的中国市场,在国际竞争中表现活跃。[Purposes]This study focuses on analyzing technology of high-frequency copper foil,profiling its application status,technological development and development routes to master development of highfrequency copper foil patent.[Methods]Through patent analysis,high-frequency copper foil patent appli⁃cation change trends,applicant area distribution,applicant ranking,technical make-up of patent appli⁃cation,and like were intensively studied.[Findings]Japan,China,USA,the republic of Korea are pri⁃mary origin regions where high-frequency copper clad copper foil patent applications are filed.[Conclu⁃sions]In the field of high-frequency copper foils,Japanese patent reserves are abundant and have abso⁃lute advantages.China′s potential patent hurdles are large today and in the future.The Chinese leading enterprises gain rapid development with 5G technology and a large Chinese market in recent years,and they have been active in international competition.

关 键 词：高频铜箔 PCB 专利申请 技术分析 

分 类 号：G306[文化科学]