电子元器件的微型化与集成化技术  

Microminiaturization and integration technology of electronic components

作　　者：史玉芳 SHI Yufang(Xuzhou Electromechanical Technician College,Xuzhou 221131,China)

机构地区：[1]徐州机电技师学院,江苏徐州221131

出　　处：《无线互联科技》2024年第13期11-13,共3页Wireless Internet Technology

摘　　要：传统的电子元器件微型化和集成化方法依赖于光刻和刻蚀等制造工艺。然而,这些工艺在实现更小尺寸和更高集成度方面存在局限性,导致GDS指标下降。为此,文章提出了新的电子元器件的微型化与集成化方法。首先基于融合理论,融合电子元器件,然后利用电子元器件的融合结果进行电子元器件结构映射,最后基于映射结果设计电子元器件集成语义约束,生成电子元器件集成本体,从而实现电子元器件的微型化与集成化。实验结果表明,该方法的GDS指标呈现显著且持续的增长趋势,具有积极影响和潜在价值。Traditional miniaturization and integration methods for electronic components rely on manufacturing processes such as photolithography and etching.However,these processes have limitations in achieving smaller dimensions and higher integration,leading to a decrease in GDS indicators.Therefore,a new method for miniaturization and integration of electronic components has been proposed.Firstly,based on fusion theory,electronic components are fused.Then,the fusion results of electronic components are used to map the structure of electronic components.Finally,based on the mapping results,semantic constraints for electronic component integration are designed to generate the electronic component integration ontology,thereby achieving miniaturization and integration of electronic components.The experimental results indicate that the GDS index of this method shows a significant and sustained growth trend,with positive impact and potential value.

关 键 词：电子元器件 微型化 集成化 

分 类 号：G642[文化科学—高等教育学]