A review on adhesion behavior of chip seal pavement and aggregate  

作　　者：Yuming Zhou Zhuyi Peng Jinyu Wang Jianguo Wei Hao Liu Di Wang Jinming Li 

机构地区：[1]Key Laboratory of Road Structure and Material of Ministry of Transport(Changsha),Changsha University of Science and Technology,Changsha 410114,China [2]School of Traffic and Transportation Engineering,Changsha University of Science and Technology,Changsha 410114,China [3]Wuhan Huike Testing Co.,Ltd.,Wuhan 430000,China [4]Department of Civil Engineering,University of Ottawa,ON KIN 6N5,Canada [5]CCCC Infrastructure Maintenance Group Co.,Ltd.,Beijing 100102,China

出　　处：《Journal of Traffic and Transportation Engineering(English Edition)》2024年第3期441-466,共26页交通运输工程学报（英文版）

基　　金：supported by National Natural Science Foundation of China(No.52108396);Open Fund of Key Laboratory of Road Structure and Material of Ministry of Transport(Changsha University of Science and Technology)(No.kfj210301)。

摘　　要：Chip seal is widely used for preventive maintenance to mitigate pavement deterioration,but it is prone to aggregate loss during pavement service.To further promote the development and application of chip seals in road engineering in China,the research progress of the adhesion behavior of aggregate and binder in chip seals was reviewed in this paper,focusing on the adhesion mechanism of emulsified asphalt and alkaline aggregate.The Influencing factors and evaluation methodology of chip seals'aggregate adhesion behavior were also discussed.The results demonstrate that the adhesion process between emulsified asphalt and alkaline aggregate is divided into three processes including infiltration,demulsification,and cluster,which is more complicated when compared to hot asphalt.When designing a chip seal,not only the characteristics of single material should be paid attention to,but also the combination of binder and aggregate matters a lot.To form good adhesion between aggregate and asphalt binder,various influencing factors such as material selection,design method,and construction technical index should be considered comprehensively in the whole design,construction,and operation process.Three methods for evaluating adhesion behavior are summarized,including macroscopic adhesion performance tests,image analysis technology,and model prediction.It is not objective to evaluate the aggregate adhesion behavior of chip seal only by a single evaluation method.A comprehensive evaluation based on the micro-macro multi-scale method should be considered in the future.

关 键 词：Chip seal Adhesion behavior Asphalt binder AGGREGATE 

分 类 号：U414[交通运输工程—道路与铁道工程]