High-current pulsed electron beam modification on microstructure and performance of Cu/CuW diffusion bonding joints  

作　　者：Na-Na Tian Cong-Lin Zhang Peng Lyu Jin-Tong Guan Jie Cai Qing-Feng Guan Shun Guo 

机构地区：[1]School of Materials Science and Engineering,Jiangsu University,Zhenjiang 212013,China [2]School of Material Science and Engineering,Yancheng Institute of Technology,Yancheng 221051,China [3]Engineering Institute of Advanced Manufacturing and Modern Equipment Technology,Jiangsu University,Zhenjiang 212013,China

出　　处：《Rare Metals》2024年第6期2819-2831,共13页稀有金属（英文版）

基　　金：financially supported by the National Natural Science Foundation of China(No.52001273);the Natural Science Foundation of Jiangsu Province(No.BK20201062)。

摘　　要：This study investigates the influence of high-current pulsed electron beam(HCPEB)modification on the microstructure and shear strength of Cu/CuW joints.Reliable solid-state diffusion bonding of modified-Cu(MCu)and modified-CuW(M-CuW)was achieved by HCPEB modification pretreatment at a temperature of 800-900℃and a pressure of 5 MPa for 10-50 min.Experiments demonstrate that HCPEB modification facilitates the dissolution of W and Cu,resulting in the formation of a Cu_(0.4)W_(0.6)solid solution and thus enhancing the uniform distribution of microstructures.Additionally,HCPEB-induced defects play a beneficial role in promoting the diffusion process by providing fast diffusion paths for elements.The optimal joints with the maximum shear strength of 213.7 MPa were obtained through bonding M-Cu and M-CuW at 900℃and 5 MPa for 30 min,which attributes to the combined effects of fine-grained strengthening and solid solution strengthening.Overall,the application of HCPEB modification showcases its effectiveness in promoting element diffusion and enhancing the mechanical performance of the joints.

关 键 词：HCPEB Element diffusion Shear strength Crystal defects Surface modification 

分 类 号：TG407[金属学及工艺—焊接]