基于激光诱导改性法制备多孔径石英玻璃通孔的工艺研究  

Study on The Preparation Process of Multi-aperture Quartz Glass Through-hole Based on Laser Induced Modification Method

作　　者：叶刚 柯峥 夏晨辉 张志模 YE Gang;KE Zheng;XIA Chen-hui;ZHANG Zhi-mo(The 58th Research Institute of CETC)

机构地区：[1]中国电子科技集团公司第五十八研究所

出　　处：《中国集成电路》2024年第7期66-69,共4页China lntegrated Circuit

摘　　要：玻璃转接板技术具有广泛的应用前景,该技术核心之一为玻璃通孔成形工艺。激光诱导改性法具有高效成孔、稳定性好、工艺简单等优点,被广泛应用。本文基于激光诱导改性法,获得了最大深宽比12:1、多种孔径尺寸的石英玻璃通孔。通过石英玻璃通孔制备过程中激光参数对通孔制备工艺影响的研究,揭示了石英玻璃激光诱导改性过程,实验结果表明,单脉冲激光能量大小对通孔制备工艺的重要性更为突出,而激光总能量并不是决定性的因素。Glass adapter plate technology has a wide application prospect,and the formation process of the through-glass via is one of the key technologies.Laser induced modification method has many advantages,such as efficient hole formation,process stability,simple process flow,and so on,so it is widely used.Based on the laser induced modification method,quartz glass vias with a maximum depth-to-width ratio of 12:1 and multiple aperture diameter were obtained.The modification mechanism of quartz glass during the laser induced modification process was obtained by studying the effect of laser parameter on the through-hole preparation process of quartz glass.The experimental results show that the importance of single pulse laser power on the through hole preparation process was more prominent,and the total laser power was not s decisive factor.

关 键 词：激光诱导改性 石英玻璃 玻璃通孔 激光能量 多孔径 

分 类 号：TN249[电子电信—物理电子学] TQ171.6[化学工程—玻璃工业]