铜基镀银引线框架抗化学腐蚀工艺过程影响研究  

Research on the Effect of Chemical Corrosion Resistance Process on Silver-coated Lead frame

作　　者：付永朝 任晨 左元亮 FU Yong-chao;REN Chen;ZUO Yuan-liang(Unimos Microelectronics(Shanghai)Co.,Ltd.)

机构地区：[1]宏茂微电子(上海)有限公司

出　　处：《中国集成电路》2024年第7期70-75,共6页China lntegrated Circuit

摘　　要：铜基镀银引线框架作为半导体封装的主要材料之一,其铜面和镀银区易受空气影响造成化学腐蚀,随着时间的变长,此种化学腐蚀程度会不断增加。由于化学腐蚀过度会造成引线框架表面的可焊性降低,最终造成焊线脱落和封装后分层问题,故铜面和镀银区的表面状态对半导体的可靠性有重要影响。本文介绍了铜基镀银引线框架生产过程中不同电镀工艺和铜保护剂类型的差异性,提出了铜基镀银引线框架生产过程中抗化学腐蚀性实现的关键控制点,为引线框架产品可靠性的提升预防提供数据支持。As one of the major materials for semiconductor packaging,the copper surface and silver surface of copper base silver-plated lead frame are susceptible to chemical corrosion caused by air and this chemical corrosion degree will continue to increase with the increase of time.Due to excessive chemical corrosion will reduce the solderability of the lead frame surface,and eventually lead to the secondary solder joint off and the lamination after packaging so that the surface state of copper surface and silver-plated area has an important effect on the reliability of the semiconductor.This paper introduces the differences of different silver plating processes and types of anti-tarnish in the production process of copper based silver plated lead frame,and key control points to achieve chemical corrosion resistance in the production process of copper based silver plated lead frame are proposed which provides data support for the reliability improvement and prevention of lead frame products.

关 键 词：引线框架表面 化学腐蚀 镀银方式 铜保护剂 

分 类 号：TN405[电子电信—微电子学与固体电子学]