移动通讯用低介电塑料基材的研究进展  

Research Progress of Low Dielectric Plastic Substrates for Mobile Communication

作　　者：欧阳双 张佳龙 叶正涛[1] OU-YANG Shuang;ZHANG Jia-long;YE Zheng-tao(School of Materials Science and Engineering,Hubei University,Wuhan 430062)

机构地区：[1]湖北大学材料科学与工程学院,湖北武汉430062

出　　处：《胶体与聚合物》2024年第2期86-90,共5页Chinese Journal of Colloid & Polymer

摘　　要：纵观移动通讯的发展史,从最开始的有线、低频低速通讯到如今的无线、高频高速通讯,随着通讯行业的发展,对移动通讯的关键元件—印制电路板(PCB)的要求也逐渐提高。因此,开发低介电常数,低介电损耗,良好的耐热、尺寸稳定性的高分子PCB板尤为重要。本文主要介绍市场上的应用高频PCB低介电高分子材料,并重点阐述环氧树脂(EP),聚酰亚胺(PI),聚四氟乙烯(PTFE),液晶聚合物(LCP)用作PCB的优缺点及对其改性的研究情况。Throughout the evolution of mobile communication,from the initial stages of wired,low-frequency,low-speed communication to the contemporary era of wireless,high-frequency,and high-speed communication,the rapid advancements in communication technology have elevated the requirements for its key component—Printed Circuit Boards(PCB).Consequently,the development of polymer PCB boards with low dielectric constant,minimal dielectric loss,superior heat resistance,and dimensional stability has become paramount.This article introduces low dielectric constant polymer materials designed for high-frequency PCBs,with a particular focus on the advantages and disadvantages of epoxy resin(EP),polyimide(PI),polytetrafluoroethylene(PTFE),and liquid crystal polymer(LCP)materials.Additionally,the research status of modifications to these materials is addressed.

关 键 词：低介电性能 高频通讯 高分子材料 印制电路板 

分 类 号：TQ314.2[化学工程—高聚物工业]