高温层压机热场分布对微波基板性能的影响  

Effect of Thermal Field Distribution in High Temperature Laminating Machine on Properties of Microwave Substrate

作　　者：郝俊宝 金霞 张海涛 HAO Junbao;JIN Xia;ZHANG Haitao(The 46th Research Institute of China Electonics Technology Group Corporation,Tianjin 300220,China)

机构地区：[1]中国电子科技集团公司第四十六研究所,天津300220

出　　处：《电子质量》2024年第7期89-94,共6页Electronics Quality

摘　　要：采用多物理仿真软件COMSOL对高温层压机热场分布进行模拟,分析不同热场对微波基板性能的影响。根据理论预测与实验结果对层压机加热管位置进行了合理调整,调整后基板表面质量、相对介电常数均匀性和剥离强度均得到了改善,消除了基板表面褶皱,相对介电常数均匀性Cv值达到0.000 3,剥离强度超过2.4 N/mm。同时,基板厚度也实现稳定可控,基板厚度的过程能力指数Cpk达到1.0。借助统计控制过程(SPC)技法和COMSOL软件解决了高温层压机热场存在的问题,大幅度降低了实验成本,为解决实际生产中遇到的问题提供了有效工具。The multi-physics simulation software COMSOL is used to simulate the thermal field distribution of the high temperature laminator and analyze the influence of different thermal fields on the performance of microwave substrate.According to theoretical prediction and experimental results,the position of heating tube of laminating machine is reasonably adjusted.After adjustment,the surface quality,relative dielectric constant uniformity and peel strength of the substrate are improved,and the surface folds of the substrate are eliminated.The relative dielectric constant uniformity Cv value reaches 0.0003 and the peel strength exceeds 2.4 N/mm.At the same time,the thickness of the substrate is stable and controllable,and the process capability index Cpk of the substrate thickness reaches 1.0.With the help of SPC technique and COMSOL software,the problems existing in the thermal field of high temperature laminating machine are solved,the experimental cost is greatly reduced,and effective tools are provided for solving the problems encountered in actual production.

关 键 词：高温层压机 热场分布 微波介质基板 COMSOL 相对介电常数 统计过程控制 过程能力指数 

分 类 号：TN41[电子电信—微电子学与固体电子学] TP391.99[自动化与计算机技术—计算机应用技术]