PCB中耐高温有机可焊保护剂成膜机理及性能研究  

Research on Coating Formation Mechanism of a High-Temperature-Resistant Organic Solderability Preservative and the Coating Performance in PCB

作　　者：王跃峰[1,2] 姜其畅 马紫微[1,2] 贾明理 苏振[1] 孙慧霞 WANG Yuefeng;JIANG Qichang;MA Ziwei;JIA Mingli;SU Zhen;SUN Huixia(Department of Physics and Electronic Engineering,Yuncheng University,Yuncheng 044000,China;Laboratory of Optoelectronic Information Science and Technology of Shanxi Province,Yuncheng 044000,China)

机构地区：[1]运城学院物理与电子工程系,运城044000 [2]山西省光电信息科学与技术实验室,运城044000

出　　处：《电子科技大学学报》2024年第4期487-494,共8页Journal of University of Electronic Science and Technology of China

基　　金：山西省高校科技创新项目(2022L476);山西省研究生教育教学改革课题(2022YJJG263);运城学院院级项目(YQ-2023069,YY-202313);运城市科技计划(YCKJ-202268)。

摘　　要：印制电路板铜焊盘表面生成耐高温有机可焊保护剂(HT-OSP)膜是克服无铅高温回流焊工艺并获得良好焊点的关键。选用2-[(2,4-二氯苯基)甲基]-1H-苯并咪唑(C_(14)H_(10)Cl_(2)N_(2))作为成膜剂,在铜层表面生成了HT-OSP膜。理论计算结合对比实验,研究C_(14)H_(10)Cl_(2)N_(2)分子与Cu原子反应生成HT-OSP膜机理。基于量子化学密度泛函理论,模拟C_(14)H_(10)Cl_(2)N_(2)分子与Cu^(+)之间的络合反应;利用红外光谱对HT-OSP膜中的特征官能团进行表征;借助X射线光电子能谱测试HT-OSP膜中Cu元素的化合价;设计对比实验分析Cu^(2+)对生成HT-OSP膜的影响。结果表明:HT-OSP膜生成机理是C_(14)H_(10)Cl_(2)N_(2)分子与Cu原子发生反应生成HT-OSP膜并沉积在铜层表面,Cu^(2+)通过络合反应促进HT-OSP膜生长。另外,HT-OSP膜的分解温度高达531℃,HT-OSP膜保护的铜层放置在自然环境中180天没有被氧化,证明HT-OSP膜具有优异的耐热性和抗氧化性。To overcome lead-free high temperature reflow process and obtain satisfactory solder joints on printed circuit board,the key issue is to generate a High-Temperature-Resistant Organic Solderability Preservative(HT-OSP)coating on the surface of copper solder pads.Selecting C_(14)H_(10)Cl_(2)N_(2) as a coating formation agent,a HT-OSP coating is formed on copper surface.Theoretical calculations combined with comparative experiments,coating formation mechanism of C_(14)H_(10)Cl_(2)N_(2) molecules reacting with copper atoms generating the HT-OSP coating is investigated.Based on the density functional theory in quantum chemistry,the complexation reactions between C_(14)H_(10)Cl_(2)N_(2) molecules and cuprous ions are simulated.The typical functional groups in the HT-OSP coating are characterized by infrared spectroscopy.The valences of copper element in the HT-OSP coating are tested by X-ray photoelectron spectroscopy.The influence of copper ions on forming HT-OSP coating is analyzed by designing comparative experiments.The results indicate that the mechanism of generating HT-OSP coating is as follows:C_(14)H_(10)Cl_(2)N_(2) molecules react with copper atoms generating HT-OSP coating deposition on copper layer surface.Copper ions promote the HT-OSP coating growth by complexation reaction.Moreover,the decomposition temperature of the HT-OSP coating is up to 531℃.The copper layer protected by the HT-OSP coating is not oxidized after 180 days in the atmospheric environment.It is proved that the HT-OSP coating possesses excellent antioxidant and heat resistance.

关 键 词：表面处理技术 耐高温有机可焊保护剂 成膜机理 密度泛函理论 印制电路板 

分 类 号：TG17[金属学及工艺—金属表面处理]