High-fidelity model to predict heat transfer enhancement for liquid film boiling on uniform micro-structured wicking surfaces  

作　　者：Vishwanath Ganesan Mohammad Jalal Inanlu Nenad Miljkovic 

机构地区：[1]Department of Mechanical Science and Engineering,University of Illinois Urbana-Champaign,USA [2]Department of Electrical and Computer Engineering,University of Illinois Urbana-Champaign,USA [3]Materials Research Laboratory,University of Illinois Urbana-Champaign,USA [4]International Institute for Carbon Neutral Energy Research(WPI-I2CNER),Kyushu University,Japan [5]Institute for Sustainability,Energy and Environment(iSEE),University of Illinois Urbana-Champaign,USA

出　　处：《National Science Review》2024年第6期86-88,共3页国家科学评论（英文版）

摘　　要：The field of thermal management in high-power electronic devices is a critical area of study,focusing on the efficient dissipation of heat to prevent device overheating and failure[1].A key aspect of this field is understanding the dynamics of thin liquid film boiling,both on uniform and non-uniform micro-structured wicking surfaces,which can significantly enhance the heat transfer effectiveness[2].This involves the study of complex thermal-hydrodynamic processes where vapor bubbles and capillary-driven liquid films interact to achieve a high heat transfer coefficient(HTC)and critical heat flux(CHF)on wicking structures[3].The development and optimization of micro-structured surfaces[4].

关 键 词：BOILING UNIFORM film 

分 类 号：O431.2[机械工程—光学工程]