基于SIwave与Icepak的PCB板的电热耦合研究  

Electro-thermal coupling of PCB based on SIwave and Icepak

作　　者：蔡宇飞 丁硕 安轩毅 陶源 张宗卫[1] CAI Yufei;DING Shuo;AN Xuanyi;TAO Yuan;ZHANG Zongwei(College of Aeronautical Engineering,Civil Aviation University of China,Tianjin300300,China)

机构地区：[1]中国民航大学航空工程学院,天津300300

出　　处：《电子元件与材料》2024年第6期721-728,共8页Electronic Components And Materials

摘　　要：随着集成电路的不断发展,面对不断提升的PCB板热设计要求,提出了一种方法准确仿真PCB板的温度分布。利用SIwave与Icepak软件,建立了PCB板和电子元件的模型,进行了PCB板的双向和单向电热耦合仿真。通过对比分析仿真与实验结果,得出以下结论:仿真得到的PCB板的温度云图与通过红外热成像仪拍摄得到的PCB板的温度云图呈现相似的温度分布趋势;在PCB板双向电热耦合仿真的基础上,采用Re-k-ε湍流模型进行PCB板单向电热耦合仿真得到的PCB板的温度分布,比采用层流模型进行的PCB板双向电热耦合仿真得到的PCB板的温度分布更准确;仿真结果与实验结果相比,最大相差2.59℃,最小仅相差0.39℃。With the development of integrated circuits,a method was proposed to accurately simulate the temperature distribution of PCB in response to the increasing thermal design requirements.Using SIwave and Icepak software,the PCB and electronic components were modeled,then the bidirectional and unidirectional electro-thermal coupling simulation of the PCB were performed.By comparing the simulation and experimental results,the conclusions are as follows:The PCB temperature cloud map obtained by the simulation and experimental with infrared thermography demonstrates similar temperature distribution trends.Based on the bidirectional electro-thermal coupling simulation of PCB,the temperature distribution of PCB obtained by using the Re-k-εturbulence model for the unidirectional electro-thermal coupling simulation is more accurate than that of the laminar flow model for the bidirectional electro-thermal coupling simulation.The simulation results were compared with the experimental results,and the maximum temperature difference is 2.59℃and the minimum is only 0.39℃.

关 键 词：印制电路板 电热耦合 湍流模型 红外成像 

分 类 号：TN41[电子电信—微电子学与固体电子学]